裸芯片的英文
发音:
"裸芯片"怎么读用"裸芯片"造句
英文翻译手机版
- bare chip
- unpacked chip
- "裸"英文翻译 exposed; naked; bare; nude
- "芯片"英文翻译 slug; chip; die; wafer
- "裸体芯片组装裸芯片安装" 英文翻译 : bare chiassembly
- "芯片" 英文翻译 : slug; chip; die; wafer
- "cmos芯片" 英文翻译 : cmos chip
- "dna芯片" 英文翻译 : dna arrays; dna microarray
- "ic芯片" 英文翻译 : integrated circuit
- "薄芯片" 英文翻译 : led reverse mounting type
- "单芯片" 英文翻译 : one-dimentional language
- "多芯片" 英文翻译 : multi-chiic
- "硅芯片" 英文翻译 : silicon chip
- "宏芯片" 英文翻译 : macro chip
- "磊芯片" 英文翻译 : led epi wafer
- "铁芯片" 英文翻译 : lamination
- "微芯片" 英文翻译 : microchip
- "芯片板" 英文翻译 : chiboard
- "芯片集" 英文翻译 : chip set; chipset
- "芯片级" 英文翻译 : onc on chip
- "芯片卡" 英文翻译 : chi card; chicard; chip card; chips carried by cards
- "芯片模" 英文翻译 : die
- "芯片骚" 英文翻译 : chienable
- "芯片上" 英文翻译 : onchipp
- "芯片业" 英文翻译 : chip industry
- "芯片战" 英文翻译 : chip war
- "芯片组" 英文翻译 : almador almador; chip set; chip system; chipset
例句与用法
- Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density
多芯片组件( mcm )是微电子封装的高级形式,它是把裸芯片与微型元件组装在同一个高密度布线基板上,组成能够完成一定的功能的模块甚至子系统。 - Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly . finite element models and apdl programes were built in ansys to conduct thermal , thermal - mechanical and vibration analysis . the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
本论文正是针对以上情况,以采用引线键合工艺的三维叠层csp / bga封装(裸芯片叠装)为研究对象,在有限元分析软件ansys中建立相关的有限元模型,编制了相应的apdl参数化分析程序,进行了温度场分析、热循环加载下的snpb合金焊点疲劳分析和实装pcb板的振动模态分析。
相关词汇
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