热应力分布的英文

• thermal-stress distribution

• "热应力"英文翻译    thermal stress; thermal load
• "分布"英文翻译    distribute; spread; scatter; ...
• "热应力分析" 英文翻译 :    thermal stre analysis; thermal stress analysis; thermal-stress analysis
• "应力分布" 英文翻译 :    distortion of stress; distribution of stresses; distributor of stress; stre distribution; stress distributions
• "应力分布图" 英文翻译 :    stress envelope; stress pattern
• "残余应力分布" 英文翻译 :    residual stress distribution
• "平面应力分布" 英文翻译 :    plane stress distribution
• "实际应力分布" 英文翻译 :    actual stress distribution
• "应力分布型式" 英文翻译 :    stress pattern
• "应力分布性质" 英文翻译 :    stress distribution property
• "热应力" 英文翻译 :    [力学] thermal stress; thermal load
• "等值矩形应力分布" 英文翻译 :    equivalent rectangular stress distribution
• "双曲线应力分布" 英文翻译 :    hyperbolic stress distribution
• "应力分布均匀化" 英文翻译 :    equalization of stress
• "轴对称应力分布" 英文翻译 :    axial symmetrical stress distribution; axially symmetrical stress distribution
• "应力分布的梯形定律" 英文翻译 :    trapezoidal law
• "应力分布涂层检验法" 英文翻译 :    stress coating
• "弹性热应力" 英文翻译 :    elastic thermal stress
• "地热应力" 英文翻译 :    geothermal stress; geothermalstre
• "交变热应力" 英文翻译 :    thermal cycling
• "内热应力" 英文翻译 :    internal thermal stress
• "热应力场" 英文翻译 :    thermal-stress field
• "热应力功能" 英文翻译 :    thermal stress duty
• "热应力计" 英文翻译 :    heat-stress meter; thermal stress meter
• "热应力裂缝" 英文翻译 :    thermal stress cracking

• Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages
  塑料封装集成电路结构热应力分布的解析解
• The snam results of local stress distribution are in close agreement with the results of computer simulation
  利用计算机模拟了温度场变化引起的铜互连线中热应力分布。
• The results indicate that the temperature and thermal stress distribution in disk are related with the medium geometry and the special distribution of pump intensity
  结果表明：激光介质中的温度分布和热应力分布与抽运光斑及介质的几何形状密切相关。
• The transient temperature and thermal stress distribution in disk of heat capacity laser pumped by high power lda are simulated by use of finite element methods , optical distortions and birefringence were computed subsequently
  摘要利用有限元数值方法，模拟计算了热容模式下片状激光介质的瞬态温度分布和热应力分布及其波前畸变和应力双折射。
• Based on a 3 - d transient thermal model with inhomogeneous heat generation , the temperature and thermal stress distribution in the disk of heat capacity laser pumped by high power laser diode array ( lda ) are simulated and analyzed by means of finite element methods
  摘要为了研究激光介质热畸变对固体热容激光器的影响，数值计算了高功率激光二极管阵列抽运片状激光介质的瞬态温度场和热应力分布。
• The results indicate that for the same pump intensity , the temperature and thermal stress distribution in the disk are not only related with the medium ' s geometry and the special distribution of pump intensity but also related with the fill factor of pump area
  结果表明，在相同的抽运功率密度下，激光介质中的温度分布和热应力分布不仅与激光介质几何构型及抽运光空间分布有关，还与抽运光斑在介质表面的填充因子密切相关。
• This paper studied two - dimension model of rotor and cylinder and builded the finite element model . generally take the rotor and the cylinder as control objects ， definite their boundary conditions ， solute their temperature fields ， and then analyst their bear expansions and distortions as well as thermal stress distribute ， to control the courses ， and keep the unit the most optimum operating condition . and put the theories into practice developed by c + + program , used as the important part of the online monitoring and management system of life of the steam turbine
  本文对汽轮机转子和汽缸的二维模型的进行分析，建立有限元模型；将汽轮机转子和汽缸作为控制对象，确定其边界条件，求解其温度场，分析其热膨胀、热变形以及热应力分布；采用c + +语言编制汽轮机高压缸、中压缸以及缸体的温度场实时在线监测程序,作为汽轮机寿命在线监测与管理系统的核心部分，用以指导汽轮机的启停及运行过程，使机组可以安全的、经济的运行。
• Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
  本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。
• Firstly , this paper describes the optimization problem of thermal stress of fabrication process and steady work process for the hollow cylinder and the infinite plate . then , thermal stress distribution is calculated making use of theoretical formulation and the results can be validated by finite element method . in optimization , the restriction condition is heat insulation performance and the objective function is danger coefficient
  本文首先对平板结构和圆筒结构梯度涂层在制备过程和稳定工作状态下的热应力优化设计问题进行描述，然后分别用解析法求解两种结构的梯度涂层在制备过程和稳定工作状态下的热应力分布，并采用有限元方法验证了热应力分布的结果，在优化设计时，以危险系数为目标函数，以涂层的隔热性能为约束条件进行设计。