多层印刷电路板的英文

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"多层印刷电路板"怎么读用"多层印刷电路板"造句

英文翻译手机版

multilayer printed circuit board

"多层"英文翻译 multichamber; multilayer; mu ...
"印刷电路"英文翻译 printed circuit; printed wir ...
"板"英文翻译 board; plank; plate
"多层印刷电路" 英文翻译 : multilayer printed circuit; printed circuit phenolic; printed circuit, multilayer
"多层印刷电路版" 英文翻译 : multilayer printed circuit board
"印刷电路板" 英文翻译 : board, printed circuit (pcb); board, printed wiring (pwb); etched amplifier; etched circuit board; etched circuit card; pcb ( print circuit board ); pcb printed circuit board; pcb/printed circuit board; printed board; printed circuit assembly; printed circuit board pcb; printed circuit boards (pcb); printed circuit board（pc board）; printed circuit plate; printed substrate; printed wiring board (pwb); printed-circuit board(pcb)(pc board); printedcircuitboard
"多层印制电路板" 英文翻译 : multilayer pc board; multilayer pcb; multilayer printed board; multilayer printed circuit board
"印刷电路板座" 英文翻译 : card socket
"主印刷电路板" 英文翻译 : main board
"印刷电路板；线路板" 英文翻译 : printed circuit board
"印刷电路板。手机电路中使用的都是多层板。" 英文翻译 : pcb
"编码印刷电路板" 英文翻译 : coding pcb(printer cicuit board)
"单面印刷电路板" 英文翻译 : single-clad board; single-sided board
"高针数印刷电路板" 英文翻译 : high pin-count printed circuit board
"可挠性印刷电路板" 英文翻译 : flexible printed circuit board
"普通印刷电路板" 英文翻译 : common printed circuit board
"柔性印刷电路板" 英文翻译 : flexible printed circuit board
"软性印刷电路板" 英文翻译 : flexible printed wiring board; fpc
"双面印刷电路板" 英文翻译 : double sided printed circuit board; double-sided printed circuit board; double-sided printed-circuit board
"添加法印刷电路板" 英文翻译 : additive printed plate
"仪表印刷电路板" 英文翻译 : pc overlay gauges; pc overlay, gauges
"印刷电路板边缘" 英文翻译 : pcb edge
"印刷电路板测试" 英文翻译 : pc board testing
"印刷电路板插架" 英文翻译 : pcb rack
"印刷电路板插接条" 英文翻译 : pcb connection strip

例句与用法

Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.分规范
Harmonized system of quality assessment for electronic components - capability detail specification : multi - layer printed boards
电子元器件用质量评估协调体系.性能详细规范:多层印刷电路板
Harmonized system of quality assessment for electronic components - capability detail specification : flexible multilayer printed boards with through connections
电子元器件用质量评估协调体系.性能详细规范:整体连接挠性多层印刷电路板
Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid multilayer printed boards with through connections
电子元器件用质量评估协调体系.性能详细规范:整体连接弯曲刚性多层印刷电路板
Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.第1节:容量详细规范性能等级a b和c
New laminate products such as flame - retardant paper laminates and glass epoxy laminates for multi - layered pcbs were introduced during the year to capture new market demands
为配合市场需要，集团已于年内推出绝缘性能较佳的环保防火纸覆铜面板fr2及供多层印刷电路板用的薄玻璃纤维覆铜面板。
Base materials for printed circuits - part 2 - 12 : specifications : thin epoxyde wowen glass fabric copper - clad laminated sheet of defined flammability , for use in the fabrication of multilayer printed boards
印刷电路用基材.第2 - 12部分:规范.多层印刷电路板制作用规定易燃性的环氧树脂机织玻璃纤维织物包铜层压板
Base materials for printed circuits . part 2 : specifications . specification no 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards
印刷电路用基材.第2部分:规范. 11号规范:多层印刷电路板制作用一般用途级环氧化合物机织玻璃纤维织物包铜层压薄板
Base materials for printed circuits . part 2 : specifications . specification number 17 : thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印刷电路用基材.第2部分:规范. 17号规范:多层印刷电路板制作用规定易燃性的聚酰亚胺机织玻璃纤维织物包铜层压板
Base materials for printed circuits . part 2 : specifications . specification no 12 : thin epoxide woven glass fabric copper - clad laminated sheet of defined flammability , for use in the fabrication of multilayer printed boards
印刷电路用基材.第2部分:规范. 12号规范:多层印刷电路板制作用规定易燃性的环氧化合物机织玻璃纤维织物包铜层压薄板