Base materials for printed circuits . part 2 : specifications - specification number 17 : thin polyimide oven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 17号规范:多层印刷电路板制作用规定易燃性的聚酰亚胺机织玻璃纤维织物包铜层压板
Base materials for printed circuits - part 2 : specifications - specification no 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 10号规范.一般用途级的多层印刷电路板制作用规定易燃性的环氧树脂机织玻璃纤维织物包铜层压薄板
Ym series is an epoxy - bond , two - part liquid thermal cure marking ink . it has such perfimance characters as good printing adaptability , fast curing rate excellent adhesion and insulation resistance . it is better to be used in making double surface and the multipke layers circuit boards Ym为双组液型热固化标记油墨，具有良好的印刷性，固化速度快，涂膜硬化后具有优异的附着力、耐化学性，特别适合用于双面及多层印刷电路板。
On top of the expansion of in - house r & d capabilities , the group has also commissioned joint venture programmes with leading research centres , including the establishment of zhejiang university - kingboard polymer research centre in the year . new laminate products such as flame - retardant paper laminates and glass epoxy laminates for multi - layered pcbs were introduced during the year to capture new market demands 除了扩大内部的研发设施，集团还与著名研究中心共同研究合作项目，其中包括于年度内成立的浙江大学建滔高分子研究中心。为配合市场需要，集团已于年内推出绝缘性能较佳的环保防火纸覆铜面板（ fr2 ）及供多层印刷电路板用的薄玻璃纤维覆铜面板。
