Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages 塑料封装集成电路结构热应力分布的解析解
The snam results of local stress distribution are in close agreement with the results of computer simulation 利用计算机模拟了温度场变化引起的铜互连线中热应力分布。
The results indicate that the temperature and thermal stress distribution in disk are related with the medium geometry and the special distribution of pump intensity 结果表明:激光介质中的温度分布和热应力分布与抽运光斑及介质的几何形状密切相关。
The transient temperature and thermal stress distribution in disk of heat capacity laser pumped by high power lda are simulated by use of finite element methods , optical distortions and birefringence were computed subsequently 摘要利用有限元数值方法,模拟计算了热容模式下片状激光介质的瞬态温度分布和热应力分布及其波前畸变和应力双折射。
Based on a 3 - d transient thermal model with inhomogeneous heat generation , the temperature and thermal stress distribution in the disk of heat capacity laser pumped by high power laser diode array ( lda ) are simulated and analyzed by means of finite element methods 摘要为了研究激光介质热畸变对固体热容激光器的影响,数值计算了高功率激光二极管阵列抽运片状激光介质的瞬态温度场和热应力分布。
The results indicate that for the same pump intensity , the temperature and thermal stress distribution in the disk are not only related with the medium ' s geometry and the special distribution of pump intensity but also related with the fill factor of pump area 结果表明,在相同的抽运功率密度下,激光介质中的温度分布和热应力分布不仅与激光介质几何构型及抽运光空间分布有关,还与抽运光斑在介质表面的填充因子密切相关。
This paper studied two - dimension model of rotor and cylinder and builded the finite element model . generally take the rotor and the cylinder as control objects , definite their boundary conditions , solute their temperature fields , and then analyst their bear expansions and distortions as well as thermal stress distribute , to control the courses , and keep the unit the most optimum operating condition . and put the theories into practice developed by c + + program , used as the important part of the online monitoring and management system of life of the steam turbine 本文对汽轮机转子和汽缸的二维模型的进行分析,建立有限元模型;将汽轮机转子和汽缸作为控制对象,确定其边界条件,求解其温度场,分析其热膨胀、热变形以及热应力分布;采用c + +语言编制汽轮机高压缸、中压缸以及缸体的温度场实时在线监测程序,作为汽轮机寿命在线监测与管理系统的核心部分,用以指导汽轮机的启停及运行过程,使机组可以安全的、经济的运行。
Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip 本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。
Firstly , this paper describes the optimization problem of thermal stress of fabrication process and steady work process for the hollow cylinder and the infinite plate . then , thermal stress distribution is calculated making use of theoretical formulation and the results can be validated by finite element method . in optimization , the restriction condition is heat insulation performance and the objective function is danger coefficient 本文首先对平板结构和圆筒结构梯度涂层在制备过程和稳定工作状态下的热应力优化设计问题进行描述,然后分别用解析法求解两种结构的梯度涂层在制备过程和稳定工作状态下的热应力分布,并采用有限元方法验证了热应力分布的结果,在优化设计时,以危险系数为目标函数,以涂层的隔热性能为约束条件进行设计。