集成电路封装的英文

• integrated circuit package

• "集成电路"英文翻译    integrated circuit; unicircu ...
• "封装"英文翻译    package; potting; encapsulat ...
• "半导体集成电路封装术语" 英文翻译 :    terminology of packages for semiconductor integrated circuits
• "小外形集成电路封装" 英文翻译 :    soic small outline integrated circuit package
• "封装集成电路" 英文翻译 :    encapsulated integrated circuit
• "扁平封装集成电路" 英文翻译 :    flat pack integrated circuit; flat package integrated circuit; flat-pack integrated circuit
• "封装的集成电路" 英文翻译 :    packaged chip; packaged integrated circuit
• "偏平封装集成电路" 英文翻译 :    planar mounted integrated circuit
• "塑料封装集成电路" 英文翻译 :    plastic encapsulated integrated circuit; plastic packaged integrated circuit
• "陶瓷封装集成电路" 英文翻译 :    ceramic encapsulated ic
• "封装的混合集成电路" 英文翻译 :    sealed hybrid
• "小外形封装集成电路" 英文翻译 :    soic small outline integrated circuit
• "cad集成电路" 英文翻译 :    cad integrate circuit
• "cmos集成电路" 英文翻译 :    cmos integrated circuit
• "mos集成电路" 英文翻译 :    metal-oxide-semiconductor integrated circuit; mos integrated circuit
• "半集成电路" 英文翻译 :    semi-integrated circuit; semiconductor integrated circuit
• "磁集成电路" 英文翻译 :    magnetic integrated circuit
• "光集成电路" 英文翻译 :    optic integrated circuit
• "硅集成电路" 英文翻译 :    silicon integrated circuit
• "集成电路" 英文翻译 :    [电子学] integrated circuit (ic); unicircuit; molectron; integrated semiconductor; monolithic circuit◇集成电路放大器 integrated amplifier; 集成电路晶体管 integrated circuit transistor; 集成电路块 integrated circuit block
• "集成电路6" 英文翻译 :    ic integrated circuit
• "集成电路板" 英文翻译 :    integrated circuit plate
• "集成电路崩" 英文翻译 :    ic chip
• "集成电路卡" 英文翻译 :    card, integrated circuit; integrated circuit card; integrated-circuit card
• "集成电路块" 英文翻译 :    chip; integrated circuit block

• Terminology of packages for semiconductor integrated circuits
  半导体集成电路封装术语
• Coplanarity problems of ic packaging
  集成电路封装的共面性问题
• Ultra - thin dia .
  集成电路封装划.
• This product design for ic assembly die attache process on die bonder machine
  本产品为ic集成电路封装工艺芯片全自动固晶机上而专门设计。
• The company ' s primary business is ic component packaging and test and memory module assembly
  公司的主要业务是集成电路封装测试和内存模块装配。
• Reinvest jingyang technology co . , ltd engaging in ic package , manufacture , test , and the components producing and selling
  转投资晶扬科技股份有限公司，从事集成电路封装制造测试服务及其零组件加工销售
• Reinvest jingyang technology co . , ltd engaging in ic package , manufacture , test , and the components producing and selling
  转投资晶扬科技股份有限公司，从事集成电路封装、制造、测试服务及其零组件加工销售
• Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
  完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
• In order to reduce the thermal strain , improve the reliability and electrical performance of the microelectronics , it is important and necessary to test the thermal deformation and the residual stress of the assemble circuit
  为降低器件封装的热应力，改善和提高产品的电热性能及可靠性，对集成电路封装的热变形及残余应力进行分析测试是十分重要的和必不可少的。

• 集成电路封装的法语：Encapsulation (électronique)
• 集成电路封装的俄语：Корпусирование интегральных схем