陶瓷封装的英文

• ceramic package
• ceramic packing

• "陶瓷"英文翻译    pottery and porcelain; ceram ...
• "封装"英文翻译    package; potting; encapsulat ...
• "多层陶瓷封装" 英文翻译 :    mlc multi-layer ceramic package
• "采用陶瓷封装的" 英文翻译 :    cga
• "陶瓷封装集成电路" 英文翻译 :    ceramic encapsulated ic
• "陶瓷封装晶体管" 英文翻译 :    porcelain-sealed transistor
• "陶瓷封装专用设备" 英文翻译 :    porcelain seal-packing equipment
• "双列直插式陶瓷封装" 英文翻译 :    cerdi ceramic dual in line package; cerdiceramic dual in line package
• "陶瓷封" 英文翻译 :    ceramic seal
• "陶瓷封接" 英文翻译 :    ceramic seal; crunch seal
• "玻璃与陶瓷封接" 英文翻译 :    glass to ceramic sealing
• "瓷封" 英文翻译 :    encapsulation
• "陶瓷扁平封装" 英文翻译 :    ceramic flat package; ceramic flat packing
• "陶瓷空气封装" 英文翻译 :    ceramic air package
• "陶瓷四方扁平封装" 英文翻译 :    ceramic quad flat pack (cqfp); pack ceramic quad flat
• "陶瓷小外形封装" 英文翻译 :    ceramic small outline
• "陶瓷扁平封装, 陶瓷扁平管壳" 英文翻译 :    ceramic flat package
• "陶瓷式引线芯片承载封装" 英文翻译 :    package ceramic leaded chicarrier
• "陶瓷式引线芯片载体封装" 英文翻译 :    ceramic leaded chicarrier package (clcc)
• "陶瓷双列直插式封装" 英文翻译 :    ceramic dual inline package; ceramic dual in-line package (cer-dip); cerdip package; package, cer-dip
• "陶瓷四边引线扁平封装" 英文翻译 :    ceramic quad flat package
• "封装" 英文翻译 :    [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; packaging
• "陶瓷" 英文翻译 :    pottery and porcelain; ceramics◇陶瓷地砖 floor tile; 陶瓷电子管 ceramic tube; 陶瓷电阻器 ceramic resistor; 陶瓷工 potter; 陶瓷管道 earthenware duct; 陶瓷金属 ceramet; ceramal; 陶瓷绝缘子 ceramic insulator; 陶瓷业 ceramics; ceramic industry; 陶瓷釉 ceramic glaze; 陶瓷原料 ceramic raw material; 陶瓷制品 ceramic
• "铁镍钴瓷封合金" 英文翻译 :    fe-ni-co ceramic sealing alloy
• "internet封装" 英文翻译 :    internet packages

• Ceramic substrate packaging , which has better heat resistance and withstand higher and lower temperature and compact
  采用陶瓷封装，和矽晶晶片膨胀系数较接近散热性能良好，耐高低温与冲击
• The unstability for steam content in the sealed devices is described , it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature
  摘要简述了集成电路陶瓷封装内部水汽含量的不稳定性，主要是由粘接材料导电胶在高温下分解释放出的水汽所造成的。
• Major producers of electrical and electronic ceramics , engineering ceramics , ceramic thick - film integrated circuits , ceramics molybdenum , manganese , tungsten metal manganese , ceramic packages such as ceramics pieces
  主要生产电子电器陶瓷、工程陶瓷、陶瓷厚膜集成电路、陶瓷钼锰、钨锰金属化、陶瓷封装外壳等各种陶瓷瓷件。

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