铜膜的英文
发音:
"铜膜"怎么读用"铜膜"造句
英文翻译手机版
- copper film
- "铜"英文翻译 copper
- "膜"英文翻译 membrane
- "包铜膜层压板" 英文翻译 : film-thin copper-clad laminate
- "铜末" 英文翻译 : flour copper
- "铜模雕刻机" 英文翻译 : matrix cutting machine
- "铜墨盒" 英文翻译 : brass ink stone box
- "铜模底" 英文翻译 : copper mould base
- "铜母线" 英文翻译 : co er bu ar; co er bus; copper busbar
- "铜模" 英文翻译 : [印刷] matrix; (copper) mould◇铜模底 copper mould base; 铜模雕刻机 matrix cutting machine
- "铜木铵素" 英文翻译 : cuproxam lignin
- "铜明矾" 英文翻译 : chalcoalumite
- "铜目木" 英文翻译 : domeki
- "铜敏化热离子检测器" 英文翻译 : copper-sensitized thermmionic detector
例句与用法
- Studies on the stress of copper interconnects include the stress measurement by xrd , computer simulation and observation the local stress distribution with snam
利用薄膜应力测试分布仪和xrd测量硅基铜膜及铜互连线薄膜宏观应力。 - Brass wires are winded between two metallic electrodes located in a vacuum chamber , where 2 m thickness films are deposited onto the substrate glass after explosive wires discharging
实验结果表明:玻璃基体表面被镀上一层致密的铜膜,具有与金属类似的导电性。在扫描电镜下观察,膜厚约为2 m 。 - Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem , the measurement of texture by xrd and ebsd , the evaluation of barriers by xps and aes
铜互连线的微观结构的研究:通过afm 、 sem 、 tem等的分析方法对铜膜及铜互连线薄膜的晶粒尺寸进行了评价。 - Xrd analysis results reveal the electroplated copper film has strong cu { 111 } texture and cu { 111 } texture weakens after annealed . the cu { 111 } texture of copper film in trenches is obviously weaker than that of the blanket copper film
在沉积态铜膜存在较强的铜{ 111 }织构,热处理以后铜膜的织构减弱,铜互连线沟槽中铜{ 111 }织构要弱于铜膜的铜{ 111 }织构。 - The results show the grain size becomes larger along with elevated temperature and the grain size in interconnects does not change evidently after annealed at 200 ? because of the effect of the trench structure
结果显示热处理后铜膜晶粒长大,但铜互连线薄膜由于沟槽结构对晶粒的长大有阻碍作用。利用xrd和ebsd测试方法对铜膜及铜互连线薄膜的织构进行评价。 - Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering , tlp bonding of al mmcs with these interlays , the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil . removing the oxidation on the surface before deposition , copper was coated by magnetron sputtering as tlp bonding interlayer
待连接表面通过磁控溅射法沉积铜膜作为中间层进行瞬间液相连接,得到的接头强度与铜箔中间层进行瞬间液相连接得到的接头强度相当,而使用磁控溅射法去除待连接表面氧化膜后沉积铜膜作为中间层进行瞬间液相连接的接头强度提高7 . 6左右。
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