超声显微镜的英文

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"超声显微镜"怎么读用"超声显微镜"造句

英文翻译手机版

acoustic microscope
ultrasonic microscope
ultrasonicmicroscope
ultrasonomicroscope

"显微镜"英文翻译 microscope
"成像超声显微镜" 英文翻译 : image-forming ultrasonic microscope
"声显微镜" 英文翻译 : acoustic microscope; sonomicroscope
"暗视声显微镜检查" 英文翻译 : dark field microscopy
"扫描激光声显微镜" 英文翻译 : scanning laser acoustic microscope
"超声波显微镜" 英文翻译 : ultrasonic microscope
"超声绕射显微镜" 英文翻译 : ultrasonic diffraction microscope
"超声衍射显微镜" 英文翻译 : ultrasonic diffraction microscope
"超声显像" 英文翻译 : echography; ultrasonoscopy
"超声显像法" 英文翻译 : ultrasonic imaging method; ultrasonic visualization
"超声显像术" 英文翻译 : ultrasonic tomography
"超声显像仪" 英文翻译 : b-scanner; b-scope; ultrasonic developing-out unit
"超声显象" 英文翻译 : echogram
"超声显象法" 英文翻译 : ultrasonic imaging method; ultrasonic visualization
"声显微术" 英文翻译 : acoustic microscopy
"超声生物显微镜检查" 英文翻译 : ubm
"超声生物组织显微镜" 英文翻译 : ultrasound biomicroscopy ubm; ultrasound biomicroscopy, ubm
"显微镜" 英文翻译 : microscope 红外线显微镜 infrared microscope; ...倍电子显微镜 electron microscope with a magnification of ... times; 双筒显微镜 binocular microscope; 读数显微镜 reading microscope; 用显微镜检查 examine with a microscope; 在显微镜下观察 observe under a microscope; 显微镜分析 microscopic analysis; 显微镜盖片 cover glass; 显微镜检查 microexamination; microscopy; microscopic examination; 显微镜检验 microscopic examination; microscopy; 显微镜切片 microscopic section; 显微镜载片 (glass) slide; 显微镜载物片 slide; 显微镜载物台 stage; 显微镜诊断 [病理学] microscopical diagnosis
"超声显示装置" 英文翻译 : ultrasonovision
"胆囊超声显像" 英文翻译 : cholecystosonography
"二维超声显像" 英文翻译 : two-dimensional ultrasonic image
"腔内超声显像" 英文翻译 : endoluminal sonography
"心内超声显像" 英文翻译 : intracardiac ultrasonic imaging
"ppi型超声显像仪" 英文翻译 : radial-circular scan sonolayergraph
"超声显像记录器" 英文翻译 : ultrasonic image recorder

例句与用法

According to the m1l - std - 883c standard of thermal cycle loading , the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint
采用mil - std - 883c标准，通过温度循环实验，使用高频超声显微镜( c - sam )无损检测技术，测量了在不同焊点状态下， b型和d型两种实际倒装焊封装芯片与底充胶界面分层裂缝传播速率。