芯片材料的英文

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"芯片材料"怎么读用"芯片材料"造句

英文翻译手机版

chip material

"芯片"英文翻译 slug; chip; die; wafer
"材料"英文翻译 material
"翅片材料" 英文翻译 : fin material
"底片材料" 英文翻译 : film stocks; stock footage
"垫片材料" 英文翻译 : gasket materials
"极片材料" 英文翻译 : pole piece material
"晶片材料" 英文翻译 : chip materials
"卡片材料" 英文翻译 : card stock
"切片材料" 英文翻译 : sectioned material
"软片材料" 英文翻译 : film stock
"叶片材料" 英文翻译 : binding material
"塑性垫片材料" 英文翻译 : plastic shim material
"垫片材料和接触面" 英文翻译 : gasket materials and contact facings
"感光胶片材料商店" 英文翻译 : sensitive film materials shop
"磨擦片材料的混合" 英文翻译 : mischverbau von belgen
"片材" 英文翻译 : sheeting
"喷气发动机涡轮叶片材料" 英文翻译 : jet engine turbine blade material
"铌酸锶钡热电晶片材料" 英文翻译 : strontium barium niobate pyroelectric crystal plate
"垫片材料的密封性的试验方法" 英文翻译 : standard test methods for sealability of gasket materials
"垫片材料的蠕变松驰作用的试验方法" 英文翻译 : standard test methods for creerelaxation of a gasket material
"垫片材料的压缩性及回弹性的试验方法" 英文翻译 : standard test method for compressibility and recovery of gasket materials
"垫片材料抗流体性能的测试方法" 英文翻译 : standard test methods for fluid resistance of gasket materials
"芯片" 英文翻译 : slug; chip; die; wafer
"平片材" 英文翻译 : flat sheet
"软片材" 英文翻译 : flexible sheet

例句与用法

Up to 100 monitor chips may be employed in a design . chip material and angle of incidence may be separately specified for each individual chip
一个设计中可监视上到100个芯片.芯片材料和入射角可个别指定
Firstly , the influence of reaction time between laser and material on the roughness is studied by changing the speed of laser beam . secondaly , the optimized parameters are found by adjusting laser power and defocus
一方面,通过改变激光加工头的运动速度,考察激光与芯片材料的相互作用时间对侧壁表面粗糙度的影响;另一方面,调整激光的功率和离焦量,找出最优化参数。
Moreover , we give a further discussion on the numerical value calculation of temperature distribution . the main problem when we design the high duty - cycle high power laser diode array we face is the large amount of heat during its operation . so we change the proportion of some ingredients and the concentration of the dopage to gain high quality iii - v material
在激光器阵列的设计过程中，针对大功率激光器严重的产热问题，尤其是高占空比工作时，会有更多的功率转化为热的现象，我们改进芯片材料的配比、掺杂，提出适应高占空比工作的器件版图结构。