焊接特性的英文

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"焊接特性"怎么读用"焊接特性"造句

英文翻译手机版

welding characteristics

"焊接"英文翻译 weld; welding; soldering; se ...
"特性"英文翻译 characteristic; character; p ...
"粘接特性" 英文翻译 : klebeverhalten stickiness
"回指链接特性" 英文翻译 : back link attribute
"审计文件链接特性" 英文翻译 : audit file link attribute
"信息通信技术的交叉连接特性" 英文翻译 : the cutting-cross nature of the ict
"定义的串行接口的电子与电缆链接特性的标准" 英文翻译 : eia
"平特性焊接电源" 英文翻译 : constant-voltage welding source
"巴接特河" 英文翻译 : barat sungai; sungai barat
"链接特征" 英文翻译 : chain feature; linked features
"弗接特黑德河" 英文翻译 : flathead river
"连接特征函数" 英文翻译 : joint characteristic function
"焊接" 英文翻译 : weld; welding; soldering; seal; sealing; sealing-in; shutting together 电弧焊接 (electric) arc welding; 焊接材料 welding material; 焊接操作 welding operation; 焊接车间 welding shop; 焊接点 point of weld; soldering point; pad; 焊接电极 [冶金学] welding electrode; 焊接电流 [电工] welding current; 焊接电源 source of welding current; welding source; 焊接方法 welding method; 焊接缝 flog; soldering joint; 焊接工 weldor; 焊接工艺 bonding technology; 焊接机 bonding machine; soldering machine; 焊接检查 welding inspection; 焊接件 weldment; 焊接强度 weld strength; 焊接缺陷 weld defect; 焊接熔池 welding pool; 焊接深度 depth of weld; 焊接温度 welding temperature; 焊接质量 welding quality
"金属也具有可焊接的重要特性" 英文翻译 : metals also possess the important property of being welsable
"间接特征存储器" 英文翻译 : indirect tag memory
"特性" 英文翻译 : characteristic(s); character; performance; features; properties; behaviour; response; characteristic property; peculiarity; speciality; specificity; specific property
"焊接（法），焊接（的）" 英文翻译 : welding
"焊接合，焊接头" 英文翻译 : welded connection
"特性，独特性；怪癖" 英文翻译 : peculiarity
"焊接；熔焊；焊接点；焊接的" 英文翻译 : weld
"焊接合,焊接头,焊接联结" 英文翻译 : welded connection
"t形焊接" 英文翻译 : jump welding; t weld; t-weld
"背材(焊接)" 英文翻译 : chill strip
"池(焊接)" 英文翻译 : molten pool
"点焊接" 英文翻译 : point welding; spot welded joint; spot welding; welding; spot

例句与用法

Welding - test for shop primers in relation to welding and allied processes - welding properties of shop primers
焊接.有关焊接和相关工艺有关的工厂底漆的试验.工厂底漆的焊接特性
Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball , the chips should be vacuum sealed shortly after the reball process
因为很容易氧化并且形成一个氧化层覆盖会降低锡球的焊接特性，所以在重新植球加工后应尽快真空封装。