沉积铜的英文

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"沉积铜"怎么读用"沉积铜"造句

英文翻译手机版

cement copper
deposited copper

"沉积"英文翻译 deposit; sedimentation; depo ...
"铜"英文翻译 copper
"电沉积铜" 英文翻译 : acid copper
"电积铜" 英文翻译 : electro deposited copper; electrodeposit copper
"淀积铜" 英文翻译 : cement copper
"电积铜粉" 英文翻译 : electrodeposited copper powder
"沉积" 英文翻译 : [地] deposit; sedimentation; deposition; precipitation 陆相沉积 continental deposit; 海相沉积 marine deposit; 河口沉积了淤泥。 the river deposited silt at its mouth. 尼罗河泛滥时, 在田野上沉积下一层泥。 when the nile is in flood, it deposits a layer of mud on the fields
"套淀积铜的锌片；锌铜偶" 英文翻译 : zinc copper couple
"沉积,沉着,沉积物" 英文翻译 : dpst
"滨沉积" 英文翻译 : offshore deposit
"沉积，下降" 英文翻译 : absenkung
"沉积；沉降" 英文翻译 : deposition
"沉积；固结" 英文翻译 : consolidation
"沉积岸" 英文翻译 : deposit bluff; deposition bluff
"沉积杯" 英文翻译 : sedimentation glass
"沉积槽" 英文翻译 : deposit tank; depositing tank; dislodger; sediment chamber; wash trough
"沉积层" 英文翻译 : crust; illuvial horizon; sedimentary deposit; sedimentary layer; sedimentary stratum; settled layer; warp
"沉积池" 英文翻译 : clearing basin; clearingbasin; decanter; deposition tank; depositional basin; sedimentation basin; settling pond; settlingpond
"沉积处" 英文翻译 : place of deposition
"沉积带" 英文翻译 : girdle of sediments; sedimentary band; sedimentation zone; zone of deposition
"沉积的" 英文翻译 : depositional; eluvial; laid down; pent-up; sedimentary; settled; water-laid
"沉积地" 英文翻译 : sedimentation tank
"沉积点" 英文翻译 : saltation point
"沉积堆" 英文翻译 : sedimentary pile
"沉积法" 英文翻译 : sedimentation

例句与用法

Depositing copper on carbon steel and its corrosion resistance
碳钢表面化学沉积铜及其耐蚀性
Copper electrodeposition in ulsi
超大规模集成电路中的电沉积铜
Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering , tlp bonding of al mmcs with these interlays , the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil . removing the oxidation on the surface before deposition , copper was coated by magnetron sputtering as tlp bonding interlayer
待连接表面通过磁控溅射法沉积铜膜作为中间层进行瞬间液相连接，得到的接头强度与铜箔中间层进行瞬间液相连接得到的接头强度相当，而使用磁控溅射法去除待连接表面氧化膜后沉积铜膜作为中间层进行瞬间液相连接的接头强度提高7 . 6左右。