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板的振动的英文

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"板的振动"怎么读用"板的振动"造句

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  • vibration of plate

例句与用法

  • Vibrations of stepped one - way rectangular plates
    阶梯式单向矩形板的振动
  • State - vector equation with damping and vibration analysis of laminates
    考虑阻尼的状态向量方程和层合板的振动分析
  • Vibration of plate
    板的振动
  • It can be used to solve free vibration problem of rectangular plates with arbitrary boundaries
    可用来求解任意边界矩形板的振动问题。
  • The problem of optimal design and control of composite laminated plates is very complexity
    在结构分析中,矩形层合板的振动控制问题相对复杂。
  • Because that the vibration amplitude of the tread is larger than the vibration amplitude of the web
    由于火车在运行过程中,踏面的振动大于辐板的振动
  • In the paper , the fundamental equtions for vibration problem of circular plate in transverse magnetic field are derived and the vibration speciality of a circular plate fixedly supported at circumference is investigated
    摘要给出了横向磁场中圆形薄板振动的基本方程,并对周边固支圆板的振动特性进行了分析。
  • Based on the tuning technology of beiliu and lingshan timbals , and with the guidance of disk vibration formula , use the modern equipment to attune the new - casted majiang timbals then analyses their audio frequency . it proves the timbal , which is similar to bian - zhong ( chimes ) , also can be attuned
    以古代北流型和灵山型铜鼓的调音技术为基础,圆板的振动公式为指导,利用现代工具对新铸造的麻江型铜鼓进行调音和音频分析,初步说明铜鼓与中原的编钟相似,也是可以进行调音的
  • The research is presented based on the classical laminate theories for special boundary conditions and few papers have been formulated based on higher - order laminate theories with various cases of boundary conditions . the paper will create the structural - engineering program with mathematica to solve the problem of composite laminated plates based on higher - order laminate theories with various cases of boundary conditions
    目前仅局限于有特殊边界条件的古典板理论,很少有文章涉到各种边界条件的高阶板理论。本文将利用mathematica的计算环境,编制结构分析程序,在各种边界条件下,应用多种板理论求解各向异性矩形层合板的振动控制问题。
  • Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly . finite element models and apdl programes were built in ansys to conduct thermal , thermal - mechanical and vibration analysis . the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
    本论文正是针对以上情况,以采用引线键合工艺的三维叠层csp / bga封装(裸芯片叠装)为研究对象,在有限元分析软件ansys中建立相关的有限元模型,编制了相应的apdl参数化分析程序,进行了温度场分析、热循环加载下的snpb合金焊点疲劳分析和实装pcb板的振动模态分析。
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