挠性印制电路的英文

• flexible printed circuit

• "挠性"英文翻译    flexibility; flexibleness
• "印制电路"英文翻译    printed circuit; printed wir ...
• "扰性印制电路" 英文翻译 :    flexible double sided printed board
• "软性印制电路" 英文翻译 :    flexible printed circuit
• "硬性印制电路" 英文翻译 :    rigid printed circuit
• "挠性印制电路用涂胶聚酰亚胺薄膜" 英文翻译 :    adhesive coated polyimide film for flexible printed circuits
• "挠性印制电路用涂胶聚酯薄膜" 英文翻译 :    adhesive coated polyester film for flexible printed circuits
• "挠性印制板" 英文翻译 :    flexible printed board
• "挠性印制线路" 英文翻译 :    flexible printed wiring
• "挠性印刷电路" 英文翻译 :    flexible printed circuit
• "全印制电路" 英文翻译 :    all print
• "印制电路" 英文翻译 :    printed circuit; printed wiring; plated circuit
• "印制电路板" 英文翻译 :    p c board; pc board; pcb printed circuit board; print plate; print-circuit board(pcb); printed board; printed circuit block; printed circuit card; printed plate; printed-circuit board; printed-circuit card
• "印制电路学" 英文翻译 :    printed circuitry
• "印制电路用挠性覆铜箔材料试验方法" 英文翻译 :    test methods for flexible copperclad material for printed circuitss
• "印制电路用挠性覆铜箔聚脂薄膜" 英文翻译 :    flexible copperclad polyester film for printed circuitss
• "印制电路用挠性覆铜箔聚酰亚胺薄膜" 英文翻译 :    flexible copperclad polyimide film for printed circuitss
• "印制电路板印制电路板" 英文翻译 :    printed circuit board
• "印制电路和印制电路板" 英文翻译 :    printed circuits and boards
• "印制板，印制电路板" 英文翻译 :    printed circuit board pcb
• "可挠性印刷电路" 英文翻译 :    circuit, flexible printed (fpc); flexible printed circuit (fpc)
• "可挠性印刷电路板" 英文翻译 :    flexible printed circuit board
• "单面印制电路" 英文翻译 :    single-sided printed circuit
• "镀镍印制电路" 英文翻译 :    printed-circuit nickel plating
• "多层印制电路" 英文翻译 :    multilayer printed circuit

• Product use : flexible printed circuit boards
  用途：用于挠性印制电路板。
• Adhesive coated polyester film for flexible printed circuits
  挠性印制电路用涂胶聚酯薄膜
• Adhesive coated polyimide film for flexible printed circuits
  挠性印制电路用涂胶聚酰亚胺薄膜
• Flexible printed circuit fp
  挠性印制电路
• Flexible printed circuit fp
  挠性印制电路
• Flexible printed circuit
  挠性印制电路
• Advances in research on low cte polyimides used in flexible printed circuit board applications
  用于挠性印制电路基板的低热膨胀系数聚酰亚胺研究进展
• Harmonized system of quality assessment for electronic components - capability detail specification : flexible printed boards with through - connections
  电子元器件质量评定协调体系.性能详细规范:有贯通连接的挠性印制电路板
• Harmonized system of quality assessment for electronic components - capability detail specification : flexible printed boards without through - connections
  电子元器件质量评定协调体系.性能详细规范:无贯通连接的挠性印制电路板
• Specification for harmonized system of quality assessment for electronic components - sectional specification : flexible printed boards with through connections
  电子元器件质量评定协调体系.分规范:带贯通连接的挠性印制电路板