底加工的英文

• stockfitting

• "底"英文翻译    bottom; base
• "加工"英文翻译    process; machining; working; ...
• "内底加工坏" 英文翻译 :    insole processing machinery
• "外底加工坏" 英文翻译 :    sole processing machinery
• "内底加工机械" 英文翻译 :    insole processing machinery
• "外底加工机械" 英文翻译 :    sole processing machinery
• "海底加工与增压技术面临的挑战与机遇" 英文翻译 :    subsea processing and boosting-technical challenges and opportunities
• "船底加铜皮" 英文翻译 :    coppering
• "底加作用" 英文翻译 :    plastering-on
• "海底加油站" 英文翻译 :    sea floor fueling station
• "井底加热器" 英文翻译 :    bottom hole heater
• "箱底加热器" 英文翻译 :    tank bottom heater
• "底加料注塑机" 英文翻译 :    bottom injection machine
• "井底加深部分" 英文翻译 :    pocket
• "内底加强符号" 英文翻译 :    inner bottom strengthened
• "加工" 英文翻译 :    (对原材料、半成品等做各种工作, 使符合规定要求) process; machining; working; handling; treating; in-process; fabrication 机加工 machining; 冷加工 cold working; 加工中草药 process medicinal herbs; 工业加工 industrial processing; 来料加工 processing of investor's raw materials; processing raw materials on client's demands; 来样加工 processing according to investor's samples; 食品加工 food processing; 艺术加工 artistic treatment; 影片加工 film process; 用全新的方法把废纸加工成新闻纸 manufacture newsprint waste paper under an entirely new process; 加工厂 fabrication plant; processing factory; 加工成本 finished cost; 加工程序 job gram; job sequence; workpiece programme;加工船 factory ship; 加工方法 job operation; processing method; 加工费 processing charges; machining cost; 加工工业 processing industries; 加工留量 allowance; allowance for finish; finishing allowance; 加工贸易 processing trade; improvement trade; 加工能力 working ability; 加工硬度 workhardness; 加工周期 process-cycle; processing cycle
• "炉底加热式均热炉" 英文翻译 :    bottom fired soaking-pit furnace
• "摇动炉底加热炉" 英文翻译 :    shaker hearth furnace
• "广底加长型球形屋根" 英文翻译 :    hebesphenomegacorona
• "环形旋转炉底加热炉" 英文翻译 :    circular rotauy hearth furnace
• "前加工 预加工" 英文翻译 :    preelaboration
• "mrna加工" 英文翻译 :    mrna processing
• "rrna加工" 英文翻译 :    ribosomal rna processing
• "trna加工" 英文翻译 :    transfer rna processing
• "车加工" 英文翻译 :    ug/lathe

• In microelectronic process , a large amount of stress which deteriorates performance of product is led in processes of slicing , lapping , edging , epi , diffusion , oxidizing , preparation of electrode and multilevel metallization , especially , process of wafer substrate
  在微电子工艺中，硅棒的拉制、切片、磨片、倒角、外延、扩散、氧化、电极制备、多层布线及划片等工艺中都会产生大量严重影响产品性能的应力，其中尤其在衬底加工工艺中最为严重。
• Bottom - up processing and feature detecting theory based on strong electrophysiological evidences has played a dominant role in the visual research for long time . people know top - down processing just by common sense . knowledge or experience are recalled from memory by reactivation of their neural representations and affected visual processes . however recently , researches from human and monkey provide experimental evidences for top - down processing . first , mnemonic representation of visual objects and faces , located in the ventral processing stream of visual perception in monkey , provide the best evidences of how neuronal codes are created by neurons that have the special ability to link the representations of temporally associated stimuli ; second , experiments suggest that not only bottom - up signals from the retina but also top - down signals from the prefrontal cortex can trigger the retrieval of associative codes , which may serve as a neural basis both for the conscious recall and for the visual processes affected by top - down processing further studies will improve people s understanding of the causal relation of activation and behavior by use of combined fmri and electrophysiology or lesion studies
  联想性编码是通过学习由一些具有特殊功能的神经元建立的，这些神经元具有将时间性关联刺激的表征联系起来的能力。其次，不仅来自视网膜的底-顶信号，而且来自前额叶的顶底信号都能触发联想性编码的提取，既可以作为有意识回忆的神经基础，又是顶-底加工影响视觉过程的基础。脑损伤病人研究具有高时间分辨率的人类功能性核磁共振成像functional magnetic resonance imaging , fmri和猴fmri研究以及猴细胞电生理分析相结合,将进一步加强人们对视觉脑机制的全面理解。
• Slicing , lapping , and edging all can lead to intensive stress and damage in wafer process because of too intensive and unbalanced mechanical action to wafer substrate , at last cumulating stress come into being . at present damage and stress has become the most important matter which affects quality and finished product ratio of wafer
  在衬底加工过程中，切片、磨片、倒角等工序都会对硅片造成大的损伤和应力，这些都是因为在加工过程中机械作用过于强烈，而且不能均衡的作用在加工的硅片上，最终造成大的应力累积。