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并行总线的英文

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"并行总线"怎么读用"并行总线"造句

英文翻译手机手机版

  • bus, concurrent
  • concurrent bus
  • parallel bus

例句与用法

  • Serial vs parallel bus structures
    串行对并行总线结构
  • The data transfer capacity ( in bits per second ) of a bit - parallel bus
    每条位并行总线上可传输数据的容量,用比特秒表示。
  • The hardware of the controller use the hierarchical and modular designing ideas . it adopt parallel bus structure and the functional module can be expanded freely by the parallel bus
    机器人控制器硬件部分按照层次化、模块化的思想设计,采用并行总线结构,可以按照需求扩展各个功能模块。
  • Via communication module , tesys model u can be connected with automation system conveniently through parallel bus , modbus or as - i bus etc . , offering the most accurate and real - time monitoring and control
    利用通信模块, tesysu电动机起动器可以通过并行总线、 modbus总线和as - i总线等方便的与自动化系统相连,提供对设备最为实时和准确的监控;
  • In the process of designing hardware , the principal and subordinate structure is adopted : the principal cpu accomplishes the communication with the group host computer ; the subordinate cpus accomplish the communication with some command post computers and observe post computers ; the principal and subordinate cpus exchange data through parallel bus to realize the communication between the group host computer and its subordinate computers
    在硬件系统设计中,采用了主从结构:主cpu完成与群主机通信,从cpu完成与各指挥所、观察所计算机通信,再通过主从cpu间并行总线的数据交换来完成群主机与其下属计算机的通信。
  • This paper , taking the oil cooler heat transfer characteristics measurement test - bed as the research object , studies the theory and technology regarding virtual instrument , and develops the date collection system using visual c . firstly , the history , state of the art and existing problems of virtual instrument is presented . then this paper discusses the hardware , software architecture , reusability , interchangeability of virtual instrument and interchangeable virtual instrument , compares parallel , serial and field bus
    本论文首先论述了虚拟仪器的发展历程及其国内外研究现状及目前虚拟仪器存在的问题;阐述了虚拟仪器( vi )的硬件体系结构及各部分在虚拟仪器中的作用,并比较了可应用于虚拟仪器的各种总线,如并行总线、串行总线和现场总线等;然后研究了虚拟仪器的软件体系结构, scpi及visa的结构,仪器的可重用性,可互操作,可互换性等。
  • Peripheral devices in embedded systems are often connected to the mcu as memory - mapped i / o devices , using the microcontroller ' s parallel address and data bus . this results in lots of wiring on the pcb ' s to route the address and data lines , not to mention a number of address decoders and glue logic to connect everything
    由于并行总线扩展时连线过多,外围器件工作方式各异,外围器件与数据存储器混合编址等,都给单片机应用系统设计带来布线复杂,线路板面积大,易引起emi和esd干扰等困难,这在一些比较复杂的应用系统是难以接受的。
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