封装外形的英文

• package outline

• "封装"英文翻译    package; potting; encapsulat ...
• "外形"英文翻译    appearance; external form bo ...
• "封装外壳" 英文翻译 :    package shell
• "薄小外形封装" 英文翻译 :    tso thin small outline package
• "微型外形封装" 英文翻译 :    miniature small-outline package
• "薄型小外形封装" 英文翻译 :    thin small outline package
• "超小型外形封装" 英文翻译 :    miniature small-outline package
• "晶体管外形封装" 英文翻译 :    transistor outline package
• "收缩型小外形封装" 英文翻译 :    sso:shrink small outline package
• "陶瓷小外形封装" 英文翻译 :    ceramic small outline
• "形引线小外形封装" 英文翻译 :    soj small outline j-lead package
• "窄节距小外形封装" 英文翻译 :    ssoshrink small outline package
• "双侧引脚小外形封装" 英文翻译 :    dso dual small outline
• "无散热片的超小外形封装" 英文翻译 :    usonf ultra small outline package non fin
• "小外形单列直插式封装" 英文翻译 :    ssip small outline single-line plug package; ssismall outline single-line plug package
• "小外形封装集成电路" 英文翻译 :    soic small outline integrated circuit
• "小外形封装引线框架规范" 英文翻译 :    specification of leadframes for small outline package
• "小外形集成电路封装" 英文翻译 :    soic small outline integrated circuit package
• "装外表" 英文翻译 :    surface
• "外形" 英文翻译 :    appearance; external form; contour; configuration; outline; profile; topography 外形为金字塔形 pyramidal in general outline
• "封装" 英文翻译 :    [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; packaging
• "包装外皮脏" 英文翻译 :    bale cover dirty
• "给装外罩；房屋" 英文翻译 :    house
• "化装外衣" 英文翻译 :    domino
• "组装外壳" 英文翻译 :    package shell

• Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages
  半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则
• Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 1
  半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1
• Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson
  半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸
• Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson
  半导体器件的机械标准化.第6部分:表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸
• Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; dimensions of p - vson
  半导体器件的机械标准化.第6 - 10部分:表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸
• Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array
  半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南
• Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals
  半导体器件的机械标准化.表面安装的半导体器件封装外形图绘制的一般规则.海鸥翼式铅端子的设计指南
• Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
  半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南
• Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array
  半导体器件的机械标准化.绘制表面安装半导体器件封装外形图的一般规则.焊球网格阵列封装尺寸的测量方法
• Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array
  半导体装置的机械标准化.第6 - 4部分:表面安装半导体装置封装外形图绘制的一般规则.球状网格阵列