塑料封装的英文

发音:

"塑料封装"怎么读用"塑料封装"造句

英文翻译手机版

plastic capsulation
plastic encapsulation
plastic package
plastic packaging

"塑料"英文翻译 plastics; plastic material; ...
"封装"英文翻译 package; potting; encapsulat ...
"塑料封装掐" 英文翻译 : plastic device
"塑料封装设备" 英文翻译 : plastic sealing-packing equipment
"塑料封装集成电路" 英文翻译 : plastic encapsulated integrated circuit; plastic packaged integrated circuit
"塑料封装引线柜架" 英文翻译 : plastic package lead frame
"塑料封装功率晶体管" 英文翻译 : plastic-packaged power transistor
"燃料封装" 英文翻译 : fuel canning
"燃料封装机" 英文翻译 : fuel encapsulating machine
"电子元器件塑料封装设备通用技术条件" 英文翻译 : general specification for electronic components plastic packaging equipments
"塑料封闭管" 英文翻译 : plastic encapsulation
"塑料封闭剂" 英文翻译 : plastic sealing compound
"塑料封袋" 英文翻译 : plastic package
"塑料封壳" 英文翻译 : plastic capsule
"破损燃料封装" 英文翻译 : defective fuel canning
"塑料袋进料封口机" 英文翻译 : plastic bag feeding and sealing plant
"塑料扁平封装" 英文翻译 : pfplastic flat package
"塑料方块平面封装" 英文翻译 : pqfp(plastic quad flat package
"塑料四方扁平封装" 英文翻译 : plastic quad flat pack
"塑料式引线晶片承载封装" 英文翻译 : plcc plastic leaded chicarrier
"塑料双列直插式封装" 英文翻译 : plastic dualinline packagege
"塑料四边引出扁平封装" 英文翻译 : pqf plastic quad flat package
"塑料无引线芯片承载封装" 英文翻译 : package plastic leadless chicarrier
"塑料无引线芯片载体封装" 英文翻译 : carrier plastic leadless chip; carrier, plastic leadless chip
"塑料引线芯片载体封装" 英文翻译 : carrier, plastic leaded chi(plcc); plastic leaded chicarrier package; plastic leaded chip carrier package

例句与用法

Studies show that water vapor quickly permeates plastic packaging material .
研究证明水蒸汽能迅速渗入塑料封装材料。
Xpxl , xpx , xpcl , xpc series
塑料封装- scx系列
Recent advances in the study of moisture absorption in plastic electronic packaging
吸收湿气对微电子塑料封装影响的研究进展
Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages
塑料封装集成电路结构热应力分布的解析解
Semiconductor devices - mechanical and climatic test methods - part 32 : flammability of plastic - encapsulated devices externally induced
半导体器件.机械和气候试验方法.第32部分:塑料封装器件的易燃性
Semiconductor devices - mechanical and climatic test methods - part 20 : resistance of plastic - encapsulated smds to the combined effect of moisture and soldering heat
半导体器件.机械和气候试验方法.第20部分:塑料封装的smds抗湿气和焊接热的综合影响
Semiconductor devices - mechanical and climatic test methods - part 31 : flammability of plastic encapsulated devices internally induced iec 60749 - 31 : 2002 corr . 1 : 2003 ; german version en 60749 - 31 : 2003
半导体器件.机械和气候试验方法.第31部分:塑料封装器
Semiconductor devices - mechanical and climatic test methods - part 32 : flammability of plastic - encapsulated devices externally induced iec 60749 - 32 : 2003 corr . 1 : 2003 ; german version en 60749 - 32 : 2003 corr . : 2003
半导体器件.机械和气候试验方法.第32部分:塑料封装器