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反应室的英文

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"反应室"怎么读用"反应室"造句

英文翻译手机手机版

  • reaction chamber
  • reactive cell (chamber)
  • reactor

例句与用法

  • Reaction chamber reactor
    反应室反应器
  • Acted by the accelerated electrons , the materials of carbon source were taken the form of plasma in the chamber
    在被加速的电子作用下,碳源物质在反应室中形成等离子体。
  • If the invaders can gain access to the reactor room by blowing up the four security terminals , they can blow up the titan
    如果入侵者炸毁四个安全终端,就能进入到反应室,也就能炸毁泰坦。
  • All these has provided us with scientific basis for designing the chamber of icp etching system and selecting the appropriate etching samples
    这些结论为设计icp刻蚀系统的反应室、选择合适的刻蚀工艺提供了科学的根据。
  • The nitrogen atoms involving in the chemical reaction originated from the working gas and nitrogen gas in the reactive chamber , and the latter is chief
    喷涂过程中参与反应的n元素来自离子气和反应室中的n _ 2气,以后者为主。
  • The growth mechanism of the ordered nanowires is discussed . novel 2 - d semiconductor sic nanonetworks have been synthesized at relatively low - temperature via vapor chemical reaction approach in homemade graphite reaction cell
    用简单气相化学反应法,于自制石墨反应室中,在无空间限制和较低温度下,合成出大面积新型二维半导体sic纳米线网。
  • The ci ~ - c : h film was prepared by the means of plasma assistance chemical vapor deposition with hydrocarbon n - butylamine ( ch3ch2ch2ch2nh2 ) as carbon source . the material of carbon source was carried into chemical vapor deposition chamber under pure hydrogen
    采用等离子体辅助化学气相沉积方法,以碳氢化合物正丁胺( ch _ 3ch _ 2ch _ 2ch _ 2nh _ 2 )作为碳源物质,用高纯氢气作为载气,将碳源物质携带进入反应室
  • This paper studies the application of inductively coupled plasma ( icp ) technology to the etching compound semiconductor insb - in film . by means of single probe and double probe , the ion density and electron temperature of chamber ( 30mm and 50mm in height respectively ) under varied process condition were diagnosed . the spatial distribution of the axial position of the two parameters and the varied curve that the two parameters varies with the power and air pressure are obtained
    利用单探针和双探针诊断30mm高反应室和50mm高反应室在各种工艺条件下的离子密度和电子温度,得到这两个参数在反应室轴向位置的空间分布、随功率和气压的变化曲线、顶盖接地和反应室体积对它们的影响,结果表明离子密度为10 ~ 8 10 ~ ( 10 ) cm ~ ( - 3 ) ,电子温度在4 10ev之间;当顶盖接地时,该处的等离子体密度明显大于不接地;在同样条件下, 50mm高反应室内的离子密度明显大于30mm高反应室。
  • Larger growth pressure of buffer layer led to the dramatic increase of structural and optical quality of gan epilayer , and the improvement in quality was attributed to the transition of growth mode from 3d to quasi 2d , which was revealed by scanning electron microscope
    发现缓冲层的生长压力变化对退火后缓冲层表面的状态影响极大,增大缓冲层生长时的反应室压力可以明显提高外延gan的晶体质量和光学质量。通过sem分析,发现提高缓冲层生长压力时,高温gan生长明显经历了从三维生长到二维生长的过渡,晶体质量明显提高。
  • The quality of buffer layer and thin films was analyzed by afm , xrd , rheed and xps respectively . the effect of the experimental parameters such as carbonization time , working pressure , c source gas flow rate , carbonization temperature , different carbonization gas and substrate on the carbonization process was studied firstly . it was observed that the size of particles was increased with the increase of carbonization time and the rms was opposite , but the trend was reduced while the carbonization time was long enough ; the size of particles was increased with the increase of working pressure too , and choosing a proper working pressure could get a smooth surface ; the size of particles was unobviously changed while the gas flow rate was low , but it was notability increased with the increase of gas flow rate while the gas flow rate was high enough , and a smooth surface could be also obtained by choosing a proper gas flow rate ; with the increase of carbonization temperature , the size of particles was increased , the rms is decreased and a good single - crystalline carbonization layer could be obtained , but a rough surface was formed at a excessive high temperature ; the rms of
    对于碳化工艺,侧重研究了碳化时间、反应室气压、 c源气体的流量、碳化温度以及不同种类的c源气体、基片取向等因素对碳化层质量的影响,研究结果表明:随着碳化时间的增长,碳化层的晶粒尺寸随之变大,表面粗糙度随之降低,但当碳化到一定时间之后,碳化反应减缓,碳化层的晶粒尺寸以及表面粗糙度的变化幅度变小;碳化层的晶粒尺寸随反应室气压的升高而变大,适中的反应室气压可得到表面比较平整的碳化层;在c源气体的流量相对较小时,碳化层的晶粒尺寸随气体流量的变化不明显,但当气体流量增大到一定程度时,碳化层的晶粒尺寸随气体流量的增大而明显变大,同时,适中的气体流量得到的碳化层表面粗糙度较低;碳化温度较低时,碳化层的晶粒取向不明显,随着碳化温度的升高,碳化层的晶粒尺寸明显变大,且有微弱的单晶取向出现,但取向较差,同时,适中的碳化温度可得到表面平整的碳化层;相比于c _ 2h _ 2 ,以ch _ 4作为c源气体时得到的碳化层表面平整得多;比起si ( 100 ) ,选用si ( 111 )作为基片生长的碳化层的晶粒取向一致性明显更好。
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