再流的英文

• reflow

• "再"英文翻译    another time; again; once mo ...
• "无再流" 英文翻译 :    no flow; no-reflow
• "再流焊" 英文翻译 :    reflow soldering
• "再流行" 英文翻译 :    resurrection
• "不再流泪" 英文翻译 :    no more tears
• "不再流行" 英文翻译 :    go/be out of fashion become/be unpopular as a style
• "不再流行,过时" 英文翻译 :    out of date
• "不再流行的" 英文翻译 :    obsolete dated; outmoded
• "光束再流焊" 英文翻译 :    beam reflow soldering
• "红外再流焊" 英文翻译 :    ir reflow soldering infrared reflow soldering
• "激光再流焊" 英文翻译 :    laser reflow soldering
• "流血,再流血" 英文翻译 :    bleeding stage of blood (cascade)
• "气相再流焊" 英文翻译 :    vapor phase soldering
• "汽相再流焊" 英文翻译 :    vapor phase soldering
• "热板再流焊" 英文翻译 :    hot plate reflow soldering
• "热风再流焊" 英文翻译 :    hot air reflow soldering
• "我不再流泪" 英文翻译 :    i'm running out of reasons to cry
• "无再流通" 英文翻译 :    no-reflow
• "无再流现象" 英文翻译 :    no-reflow
• "再流焊接" 英文翻译 :    reflow soldreing
• "再流环境" 英文翻译 :    reflow environment
• "再流回焊接" 英文翻译 :    over reflow soldering
• "再流平涂料" 英文翻译 :    reflow coating
• "再流气氛" 英文翻译 :    reflow atmosphere
• "再流通损害" 英文翻译 :    reflow damage

• Technology requirement for infrared hot air reflow soldering
  红外热风再流焊接技术要求
• Pin - through - hole reflow soldering technology
  穿孔再流焊技术
• The research of reflow soldering
  再流焊工艺技术研究
• And has it another important object to accomplish ten thousand years to come
  它是不是还有另外重要的目的，再流它个一万年呢？
• Excellent in solderability and high heat resistance with either flow or reflow soklering
  可焊性和耐焊性优，适用于流焊和再流焊。
• No - reflow after acute myocardial infarction and reperfusion and protective effects of valsartan on myocardium in a mini - swine model
  猪急性心肌梗死再灌注后无再流与缬沙坦的心功能保护作用
• The area along the edge of the pool in which water overflows during a race and is recirculated through the filtration system
  位于游泳池边缘的地方，在比赛时允许水越过去。并且通过过滤系统再流回来。
• Because the job has to " flow " from the requesting machine to the remote machine and then back again , we must differentiate between
  由于作业必须从发出请求的机器“流”到远程机器上，然后再流回来，因此我们必须对
• Delamination caused by electrical - over - stress ( eos ) and moisture expansion during reflow soldering have shown different delamination patterns
  由过电应力( eos )和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式。
• Ink flows through the mesh in the open areas of the stencil onto substrate when there is the horizontal movement of the squeegee relative to the stencil
  胶刮子和模版有一个横向活动动入,油墨便可流经模版的空位,再流到基质。