互连线的英文

• interconnecting wire
• interconnection line
• interties

• "互连"英文翻译    interconnection; nexus
• "线"英文翻译    thread; string; wire
• "铝互连线" 英文翻译 :    aluminum interconnect
• "铝互连线，铝" 英文翻译 :    aluminum interconnect
• "铜互连线" 英文翻译 :    copper interconnect
• "硬连线互连" 英文翻译 :    hardwired interconnection
• "铜线互连，铜互连线" 英文翻译 :    copper interconnect
• "地上互连线路" 英文翻译 :    terrestrial interconnection link
• "连线" 英文翻译 :    cables; connecting lead; connecting line; online; tie line; wired
• "互连" 英文翻译 :    interconnection; nexus
• "父连线" 英文翻译 :    father link
• "连线、线上" 英文翻译 :    online
• "连线表" 英文翻译 :    wire list
• "连线草" 英文翻译 :    field balm
• "连线到" 英文翻译 :    connecting to
• "连线点" 英文翻译 :    connection point
• "连线段" 英文翻译 :    wire segment
• "连线盒" 英文翻译 :    jb
• "连线器" 英文翻译 :    wire connector
• "连线网" 英文翻译 :    net
• "硬连线" 英文翻译 :    hardwired
• "光互连" 英文翻译 :    oi optical interconnection; optical interconnect
• "互连板" 英文翻译 :    interconnection plane
• "互连表" 英文翻译 :    interconnection list
• "互连层" 英文翻译 :    interconnection layer; interconnection level

• Interconnect wire delay questions in deep submicron ic design
  深亚微米集成电路设计中的互连线延迟问题
• Shielding area optimization under the solution of interconnect crosstalk
  减小互连线串扰的屏蔽线面积优化
• Image method used for coplanar interconnects dependent parameter calculation
  用镜像电荷法求取共面互连线寄生参数
• Geometrical optimizing design of interconnection for deep sub - micrometer vlsi circuits
  电路中互连线的几何优化设计
• The snam results of local stress distribution are in close agreement with the results of computer simulation
  利用计算机模拟了温度场变化引起的铜互连线中热应力分布。
• The mechanical simulation compared the stress distribution in copper lines and pore , with the result that the maximum stress locates in the corner
  在力学模拟过程中，计算了铜互连线和通孔的热应力的分布。
• Studies on the stress of copper interconnects include the stress measurement by xrd , computer simulation and observation the local stress distribution with snam
  利用薄膜应力测试分布仪和xrd测量硅基铜膜及铜互连线薄膜宏观应力。
• On the other hand , tddb experiments of copper interconnection have been taken to prove the performance improvement of interconnect by the use of low - k dielectric
  试验方面则进行了铜互连线的tddb试验，来验证低k介质对互连性能的改善。
• Consequently , the metal interconnects of vlsi have smaller sectional area and carry increasing power density , which made the electromigration become one of the main latent damage modes
  作为vlsi互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。

• 互连线的日语：れんけいせん