wafer造句

• Now people can produce a wafer silicon .
  现在人们能够生产一种硅晶薄片。
• Historically, wafers were waxed onto a metal plate .
  过去片子是用石蜡固定到金属板上。
• Personnel must wear proper clothing to protect the wafers .
  工作人员必须穿适当的服装以保护硅片。
• All organic and metallic residues on the wafers must be removed .
  片子上所有的有机和金属残留物均必须清除。
• The dust produced during slicing weighs almost as much as the wafers .
  在切割时所产生的碎屑几乎和薄片一样重。
• Large diameter wafers are feasible and 200-mm wafers have been produced .
  大直径片子已不难制造，200mm的片子也已产生了。
• The method is to coat a wafer of silicon with a protective layer of silicon dioxide .
  其方法是往硅片上涂上一层二氧化硅防护膜。
• Laser making of wafers for identification purpose will also become a new attribute .
  为了定位，片子上的激光标记也将成为新的标志。
• No food that i could dream of seemed half so utterly delicious as vanilla wafers .
  我所梦想的任何食物都不如香草薄饼那么可口有味。
• Sem stages are now available that can handle wafers 125 mm and larger in diameter .
  现今已有能处理125mm和更大直径的片子的SEM样品台。
• A wafer of a moon was shining over gatsby's house, making the night fine as before .
  一轮明月正照在盖茨比别墅的上面使夜色跟先前一样美好。
• The reactors for this type of deposition are easily scaled to accommodate 125-or 150-mm wafers .
  这种淀积反应器很容易达到适应125或150mm的基片。
• The processing characteristics and some material properties of silicon wafers depend on the orientation .
  硅片的工艺性质与某些材料特性均与晶向有关。
• After completely processed wafers are tested, those chips that pass the tests are ready to be packaged .
  全部工艺完成后，片子要进行测试，合格的片子便去封装。
• In one variant of this process the bumps are etched onto the tape rather than deposited on the wafer .
  这种工艺有一种方式是，凸出物被蚀刻在带上，而不是沉淀在硅片上。
• The major advantages of these reactions are excellent uniformity, large load size, and ability to accommodate large diameter wafers .
  这种反应器的主要优点是优越的均匀性，较大的负载量及适应大直径基片的能力。
• The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .
  按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。
• Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer .
  光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。
• Polished wafers are subjected to a number of measurements that are concerned with cosmetic, crystal perfection, mechanical, and electrical attributes .
  抛光好的片子还要进行许多测试，如外观，晶体完整性，以及力学和电学性质。
• Ultrathin wafer level chip size package technology
  超薄型圆片级芯片尺寸封装技术