( 2 ) on the research of the software ' s architecture of motion control , the high - speed and high - accuracy algorithm of interpolate for parameter curve is proposed , which is adaptive for speed ( 2 )研究了高速数控运动控制的软件结构，并应用二次插补策略，提出了一种基于参数曲线的进给速度自适应的高速高精插补算法。
To raise machining efficiency and make nc machine working in a perfect state , manipulator would constantly adjust feed rate and main spindle speed trim knobs in the operate panel 为了提高加工效率，操作者在加工过程中根据加工状况不断地调整操作面板上的进给速度、主轴转速这两个参数的修调旋钮，使机床工作在较理想的状态。
The spkm ( serial - parallel machine tool ) is a new type of machine tool developed in the recent years . it is consisted of serial and parallel mechanism which increases spkm " s displacement and rotary angle , as well as stiffness , accuracy and feed speed 混联机床不仅继承了并联机床高刚度、高精度和高进给速度等优点，还具备了串联机床大移动行程和大旋转运动角的特点。
These machines and tools have a rich adjustment merit ability , and his two - way riveting bit , riveting pressure and advance to speed can be transferred to riveting capacity , and system pressure also can be transferred , and fully pledges optimum riveting effect 该机具有丰富的调整功能，其双向铆接位铆接压力进给速度铆接量都可调校，系统压力也可调，充分保证最佳的铆接效果。
Generally , numerical control machine ( nc ) machining workpieces depended on parts " program . some cutting parameters , such as cutting rate , feed rate and cutting depth etc , are fixed on nc machining reference handbook and manipulator ' s experience 一般数控机床在加工生产中是根据编制的加工程序进行工件的切削，加工过程中的一些参数如：切削速度、进给速度、切削深度等都是在编程时根据机床加工手册和操作者的经验确定。
Many technologies are involved in high - speed cnc systems . as one of the key technologies of high - speed cnc , motion control technology is the main difference from traditional cnc , and it directly affect the velocity and track ' s precision of high - speed machining ' s 它是一门综合技术，涉及非常广泛，其中高速数控系统的运动控制技术是高速数控区别于常规数控的关键技术之一，它直接决定着高速数控加工进给速度和加工轨迹精度的控制范围。
By using the general jigs for the general tools , it is difficult to get terrifically slow feeding speed , stable machining quality and smart micro profile . the overall frame of the control system on micro fabrication process of excimer laser was analyzed and instituted based on its unique characteristics 在微细加工中如果采用传统的数控加工机床，由于其体积庞大，夹持工具粗重，难以获得极低的加工进给速度、稳定的加工质量和灵活多变的微小加工轮廓。
The results show that , when increasing the feed rate of the grinding wheel , decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel , the material removal rate in the wafer rotating grinding increase , the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel , decreasing the feed rate of the grinding wheel and using finer grit grinding wheel , the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ) , beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000 , the material removal rate decreases and the wafer surface roughness has no obvious improvement 研究结果表明，增大砂轮轴向进给速度和减小工件转速，采用粗粒度砂轮有利于提高磨削矽片的材料去除率，砂轮轴向进给速度对材料去除率的影响最为显著；适当增大砂轮转速，减小砂轮轴向进给速度，采用细粒度砂轮可以减小磨削表面粗糙度；在其它条件一定的情况下，砂轮速度超过一定值会导致材料去除率减小，主轴电机电流急剧增大，表面粗糙度变差；采用比# 2000粒度更细的砂轮磨削时，材料去除率减小，矽片表面粗糙度没有明显改善。
The system would regulate feed rate instantly to maintain cutting power invariability depend on monitoring the whole machining process at any time . the intelligent control system enhance nc machine adaptive ability and intelligent level . the machining efficiency is improved and the cost of machined workpiece is reduced with the quality guaranteed 该系统对整个加工过程进行实时检测，根据检测到的加工状态实时调整进给速度，维持切削功率约束值不变，以提高数控机床在切削加工过程中的适应能力和智能水平，旨在充分发挥加工中心的加工潜力，在保证加工精度的条件下，提高切削效率，降低工件的制造成本。
By using a wafer - rotating grinding machine , the influence of the main process factors including grit size of diamond grinding wheel , rotating speed of the wafer chuck table , rotating speed and the down feed rate of the cup grinding wheel on the material removal rate , spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated 摘要利用基于自旋转磨削原理的矽片超精密磨床，通过试验研究了砂轮粒度、砂轮转速、工件转速及砂轮进给速度等主要因素对材料去除率、砂轮主轴电机电流以及磨削后矽片表面粗糙度的影响关系。
