基底材料

• Among those methods , the vacuum metalizing method has been generally used at the early stage of cellular phone production , but has scarcely used at present due to the problems that the productivity is low , because of low productivity , high cost and poor adhesion of metal film with substrate
  在这些方法中，真空金属镀方法曾普遍使用于早期的蜂窝电话生产中，但是目前罕见使用，由于生产效率低下，成本高，金属镀膜与基底材料的粘附力差。