Through the electromigration experiment , the electromigration resistance of copper interconnection with different width was compared , its mtf and activated energy was calculated , and the failure mechanism was explored . then , difference between copper interconnection and aluminum interconnection was studied 通过电徙动试验，研究比较了不同宽度的铜互连线的抗电迁徙能力，计算了其中值寿命和激活能，探讨了其失效机理，并与铝互连线进行了比较。
We have analysed fecu granular film to coercivity and particle activation energy , can establish physical model with the change relation of fe content , have discussed coercivity and the granular interaction in fecu granular film with the change law of fe content , have discussed the influence of granular couple interaction on coerciv ity 分析了fecu颗粒膜矫顽力和粒子激活能随fe含量的变化关系，建立物理模型，探讨了fecu颗粒膜中颗粒相互作用及矫顽力随fe含量的变化规律，讨论了颗粒耦合相互作用对膜的矫顽力的影响。
Sc shows no diffusion during heated between 800 ? to 1290 ? . analysis the result of all the experiments above , we can know porous matrix , nanometer re oxide particles and fine crystal structure can accelerate the active matter diffusion to the surface , and do good effect to the emission performance of cathode 阴极表面的空隙有利于活性物质的扩散；纳米尺度的稀土氧化物自身能量高，易于克服扩散激活能而进行扩散；发射过程中阴极表面的微晶化使表层晶界增多，活性物质扩散通道增多，利于扩散进行。
4 we use make thin film adsorption desorption model , have studied the particle desorption activation in fecu granular film , energy show with the change relation of fe content in membrane : the desorption activation of particle in fecu granular film can want to spread activation than fe or cu can big near 5 times , particle desorption activation energy value between 3 . 815ev and3 . 858ev increase , with fe content instead of increasing linearly 4 、利用io . h . ro详无eu提出的薄膜吸附脱附模型，研究了fecu颗粒膜中粒子脱附激活能与膜中fe含量的变化关系，表明: fecu颗粒膜中粒子的脱附激活能要比fe或cu的扩散激活能大近5倍，粒子脱附激活能数值在3 ， slsev ~ 3 . 858ev之间，随fe含量增加而非线性地增大。
Caculation is carried through adopting mechanism function of the first order reaction , f1 : f ( ) = l - . the results have good linear relativities , a , the precipitated fractions are excellently representative , and f1 is ascertained the most probably mechanism function of " phase precipitation . the electric field reduces activation energies of " phase precipitation and average sizes of " particles both in 2090 and 1420 alloys 采用一级反应的模型函数f1 ： f ( ) = 1 - ，计算了相析出的动力学，计算结果具有良好的线性相关性，并且具有很好的代表性，确定f1为相析出的最概然机理函数；电场固溶使2090合金和1420合金升温时效过程的相析出激活能有一定程度的减小，并减小了相颗粒的平均尺寸。
Because the routine test method could not meet the requirement of modern devices , the author put forward a new test method called temperature ramp measurement （ trm ） . by this method , we can observe dynamically the whole process of devices " degradation , so the estimation value of life and failure active energy can be extracted accurately 针对目前常规评价方法不能适应当前微电子器件快速发展的需求，提出了恒定电应力的温度斜坡法（简称trm法） ，动态观察和分析器件退化的全过程，应用此方法给出了实验样品的失效激活能和寿命预测值，并与常规方法进行了比较，得到了比较一致的结果。
A reliability experiment of thermal aging was carried out for the two types of joints , scanning electron microscopy , energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints , and kinetics model of imc formation was established . the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature , imc growth is more sensitive to the aging temperature than the aging time , the activation energy of cu - al imc growth is 97 . 1kj / mol and the major forming cu - al imc are cual2 and cu9al4 , the activation energy of au - al imc growth is 40 . 1kj / mol and the main au - al imc are au4al and au5al2 , with au2al and aual at the interfacial periphery of joints , the rate of cu - al imc growth is about 1000 times slower than that of au - al imc , and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours 研究结果表明:金属间化合物厚度与老化时间的关系符合抛物线法则,金属间化合物的生长对老化温度比老化时间更加敏感; cu - al金属间化合物生长的激活能为97 . 1kj / mol ,老化后金属间化合物呈层状分布,主要相为cual2和cu9al4 ; au - al金属间化合物生长的激活能为40 . 1kj / mol ,主要相为au4al和au5al2 ,同时在界面周边区域生成了au2al和aual ;老化过程中cu - al金属间化合物生长速率比au - al金属间化合物生长速率小103数量级;金丝球键合点200老化96小时出现了明显的kirkendall空洞和裂纹,但铜丝球键合点200老化2900小时和250老化169小时都没有形成空洞和裂纹。
