Insulating materials - industrial rigid laminated sheets based on thermosetting resins for electrical purposes - specifications for individual materials - requirements for rigid laminated sheets based on melamine resins 绝缘材料.电工用热固性树脂基工业硬质层压薄板.单项材料规范.三聚氰胺树脂基硬质层压薄板要求
Insulating materials - industrial rigid laminated sheets based on thermosetting resins for electrical purposes - specifications for individual materials - requirements for rigid laminated sheets based on polymide resins 绝缘材料.电工用热固性树脂基工业硬质层压薄板.各种材料规范.对聚酰亚胺树脂基刚性层压薄板的要求
Insulating materials - industrial rigid laminated sheets based on thermosetting resins for electrical purposes - part 3 - 6 : specifications for individual materials - requirements for rigid laminated sheets based on silicone resins 绝缘材料.电工用热固性树脂基工业硬质层压薄板.第3 - 6部分:专用材料规范.硅树脂基硬质层压薄板的要求
Insulating materials - industrial rigid laminated sheets based on thermosetting resins for electrical purposes - part 3 - 4 : specifications for individual materials - requirements for rigid laminated sheets based on phenolic resins 绝缘材料.电工用热固性树脂基工业硬质层压薄板.第3 - 4部分:专用材料规范.酚醛树脂基硬质层压薄板的要求
Insulating materials - industrial rigid laminated sheets based on thermosetting resins for electrical purposes - part 3 - 5 : specifications for individual materials - requirements for rigid laminated sheets based on polyester resins 绝缘材料.电工用热固性树脂基工业硬质层压薄板.第3 - 5部分:专用材料规范.聚酯树脂基硬质层压薄板的要求
Base materials for printed circuits . part 2 : specifications . specification no 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 11号规范:多层印刷电路板制作用一般用途级环氧化合物机织玻璃纤维织物包铜层压薄板
Insulating materials - industrial rigid laminated sheets based on thermosetting resins for electrical purposes - part 3 - 7 : specifications for individual materials - requirements for rigid laminated sheets based on polyimide resins 绝缘材料.电工用热固性树脂基工业硬质层压薄板.第3 - 7部分:专用材料规范.聚酰亚胺树脂基硬质层压薄板的要求
Base materials for printed circuits . part 2 : specifications . specification no 12 : thin epoxide woven glass fabric copper - clad laminated sheet of defined flammability , for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 12号规范:多层印刷电路板制作用规定易燃性的环氧化合物机织玻璃纤维织物包铜层压薄板
Base materials for printed circuits - part 2 : specifications - specification no 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 10号规范.一般用途级的多层印刷电路板制作用规定易燃性的环氧树脂机织玻璃纤维织物包铜层压薄板
Base materials for printed circuits . part 2 : specifications . specification number 19 : thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 19号规范:多层印刷板制作用的规定易燃性的双马来酰亚胺三嗪改良型环氧化合物机织玻璃纤维织物包铜层压薄板
