Harmonized system of quality assessment for electronic components - capability detail specification : multilayer printed boards 电子元器件用质量评估协调体系.性能详细规范:多层印制电路板
Printed boards ; part 9 : specification for flexible multilayer printed boards with through connections ; identical with iec 60326 - 9 : 1991 印制电路板.第9部分:带贯穿连接的柔性多层印制电路板
Specification for harmonized system of quality assessment for electronic components - sectional specification - multilayer printed boards 电子元器件质量评定协调体系规范.性能分规范:多层印制电路板
Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification iec 62326 - 4 : 1996 ; german version en 62326 - 4 : 1997 印制电路板.第4部分:层间连接刚性多层印制电路板.分
Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid double - sided printed boards with through connections 电子元器件质量评估协调体系.性能详细规范:整体连接弯曲刚性双面多层印制电路板
Founded in 2002 , lulutong electronics co . , ltd is a high - tech enterprise specialized in high - precision double - side and multi - layer printed circuit board 路路通电路科技有限公司成立于2002年，是一家专业生产高精密双面和多层印制电路板的高新科技企业。
Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a , b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997 印制电路板.第4部分:层间连接刚性多层印制电路板.分
Specifications . specification no . 19 . thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 规范.第19号规范:多层印制电路板构件规定的可燃性双马来酰亚胺三嗪改型氧化物玻璃纤维编织包铜叠层板材
Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board 印制电路板用覆箔板.第103部分:印制电路连接专用材料.第1节:多层印制电路板制造用粘结片材的半固化片规范
Specifications - specification for thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards - specification no . 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards 规范.多层印制电路板生产用普通级环氧树脂纺织玻璃纤维覆铜层压薄板规范.第11号规范:多层印制电路板生产用普通级环氧树脂纺织玻璃纤维覆铜层压薄板
