圆片

• Slip - a defect pattern of small ridges found on the surface of the wafer
  划伤-晶圆片表面上的小皱造成的缺陷。
• Notch - an indent on the edge of a wafer used for orientation purposes
  凹槽-晶圆片边缘上用于晶向定位的小凹槽。
• Crack - a mark found on a wafer that is greater than 0 . 25 mm in length
  裂纹-长度大于0 . 25毫米的晶圆片表面微痕。
• Wafer scale integrated circuit
  圆片规模集成电路
• Wafer - level packaging technology
  圆片级封装技术
• Smudge - a defect or contamination found on the wafer caused by fingerprints
  污迹-晶圆片上指纹造成的缺陷或污染。
• Profilometer - a tool that is used for measuring surface topography
  表面形貌剂-一种用来测量晶圆片表面形貌的工具。
• Mound - a raised defect on the surface of a wafer measuring more than 0 . 25 mm
  堆垛-晶圆片表面超过0 . 25毫米的缺陷。
• Buried oxide layer ( box ) - the layer that insulates between the two wafers
  氧化埋层( box ) -在两个晶圆片间的绝缘层。
• Individual wafer retrieval
  晶圆片个别取出