Standard specification for high - strength , high - conductivity copper - alloy wire for electronic application 电子用途的高强度高传导率铜合金线的标准规范
Special for cob bonding wire al si fine wire fine gold lead bonding wire and electronics manufacturing service , have been evaluated vendor for motorola . imported equipment and material from usa , uk , germany and japan . advanced process under clean room environment 主要开发和生产cob邦定铝线led键合金线高纯铝线fine bonding wire ，同时提供电子产品委托生产服务ems ，是motorola公司的正式供货商。
Based on the established three - dimensional physical model , simplified terms , specified material parameters in thermal and physical properties , boundary conditions , and the calculation method of heat convection of cooling water , the numerical simulation and analysis on steady - state temperature field for continuous unidirectional solidification of niti shape memory alloy wire billets were proceeded under the condition of different combined parameters using ansys finite - element software 在建立三维物理模型以及确定材料热物性参数、边界条件与冷却水对流换热系数计算方法的基础上，采用ansys有限元软件对不同参数组合条件下镍钛形状记忆合金线坯连续定向凝固的稳态温度场进行了数值模拟。
