To decrease the reacting velocity of the bath and self - decomposition , the method of continuously dripping the silver solution into the reducing solution was introduced Tem观察发现，直接镀银后镀覆在以。表面的金属颗粒粒径为50urn ，先镀铜再镀银后降至20urn左右。
Firstly , the complex decoy is prepared by the means of electroless chemical silver plating and copper plating on the surface of nitrocellulose substrate 在诱饵剂的制备方面：首先选用硝基纤维素片作为复合诱饵剂的基片，实施化学镀银和化学镀铜实现了复合诱饵剂的制备。
Final results indicated that the way being fit for plating copper on the surface of carbon fibers was that carbon fibers were oxidized in hot air and boiled in nitric acid at high temperature 试验发现采用热空气和浓硝酸联合氧化的方法可使碳纤维获得适于镀铜的表面状态。
Provide solvent of the pcb surface treatments such as copper plating , nickel plating and tin plating on pcb production f provide etching technologies of titanium ; stainless steel copper 提供其他表面处理的技术服务如：镀铜镀镍镀锡等pcb制造所用的添加剂和工作液铝合金化学氧化等技术专案
. 3 base materials for printed circuits ; part 2 : specifications ; specification 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test , economic quality ; amendment 3 印制电路用基材.第2部分:规范.第14号规范:限定可燃性的酚醛纤维素纸镀铜层压板
A lot of experiments showed that the surface of carbon fibers might gain high quality plating copper coating in citrate solution and craft parameters of plating had great influence on plating copper 试验表明采用柠檬酸盐镀液，可在碳纤维表面获得优质镀铜层，合理控制各种电镀工艺参数对镀铜效果有十分重要的影响。
It has been pointed out that , with the development of microelectronics , the electroplating of copper has been currently focused on , owing to its engineering significance 结合铜在微电子工业中的应用，综述了硫酸盐镀铜中铜的电沉积机理、铜镀层微结构、添加剂对铜电沉积过程的影响以及铜电沉积初期行为方面的研究进展。
The technological steps and conditions of chemical silver plating and copper plating are researched systematically . the effect factors that can affect the conductivity of the plating layer are all analyzed specially 在此基础上开展化学镀的各步工艺条件的研究，摸索出一套化学镀银和化学镀铜的各步工艺条件和配方配比。
