The major sanitizers ( chlorine , bromine , iodine , trisodium phosphate , quaternary ammonium compounds , acids , ozone ) used for vegetable decontamination were summarized . the advantages and disadvantages were also disoussed 摘要综述了净菜常用的消毒杀菌剂如卤素及卤素化合物、离子化合物质、有机酸、活性氧化合物等各自的优缺点。
. 5 base materials for printed circuits - part 2 : specifications ; specification no . 9 : epoxide cellulose paper core , epoxide glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test ; amendment 5 印制电路用基材.第2部分:规范.第9号规范:规定易燃性的环氧化合物纤维素纸环氧玻璃布表面铜覆层压板
Base materials for printed circuits . part 2 : specifications . specification no 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 11号规范:多层印刷电路板制作用一般用途级环氧化合物机织玻璃纤维织物包铜层压薄板
Base materials for printed circuits . part 2 : specifications . specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test 印刷电路用基材.第2部分:规范. 18号规范:规定易燃性的双马来酰亚胺三嗪改良型环氧化合物机织玻璃纤维织物包铜层压板
Base materials for printed circuits . part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test 印刷电路用基材.第2部分:规范. 18号规范.规定易燃性的双马来酰亚胺三嗪改良型环氧化合物机织玻璃纤维织物包铜层压板
Base materials for printed circuits . part 2 : specifications . specification no 12 : thin epoxide woven glass fabric copper - clad laminated sheet of defined flammability , for use in the fabrication of multilayer printed boards 印刷电路用基材.第2部分:规范. 12号规范:多层印刷电路板制作用规定易燃性的环氧化合物机织玻璃纤维织物包铜层压薄板
Materials for printed boards and other interconnecting structures - part 2 - 12 : sectional specification set for reinforced base materials , clad and unclad - epoxide non - woven aramid laminate of defined flammability , copper - clad 印刷板及其它互连结构用材料.第2 - 12部分:包覆和不包覆的非增强基材分规范集.规定易燃性的环氧化合物非机织的芳香聚酰胺包铜层压板
