Above analysis can provide instructions for grain boundary design and controlling in grain boundary engineering . dynamics intergranular fracture process is modeled with considerations of grain boundaries damage 通过考虑晶界损伤，进一步对拉伸试样破坏单元的动态沿晶断裂过程进行了数值模拟分析。
After ten passes , the average grain size of the microstructure which including high angle boundaries is about lum . the vickers hardness increases rapidly after ecap , from 78 . 7hv to 185 . 3hv Ecap十道次时，晶粒尺寸在1 m左右，晶界为大角度晶界，硬度明显增加，显微硬度从原始态的78 . 7hv增加到185 . 3hv 。
These disc type semi - conductive capacitors are reformed smaller size with larger capacitance than usual hi - k type ceramic capacitors . the following is the comparative list for two kinds of semi - conductive capacitors 圆片型半导体电容器具有较高介电常数，电容器体积更小，电容量更大，有表面层和晶界层之分。
Postulating that the second - phase participle is a ball together with newton ' s classical mechanics , we develop a new physical model successfully in the thesis under condition that the grain boundary is pinned by the second - phase participle 假定二相粒子为球形并根据牛顿经典力学理论，本文成功开发了新的二相粒子钉扎晶界的物理模型。
Mgo and al2o3 can form mgal2o4 existing mainly on the grain boundary through solid phase reaction , which limited the migration of the grain boundary and thereby inhibited the abnormal growth of the alumina grain Mgo能与al _ 2o _ 3发生固相反应生成主要存在于材料晶界处的mgal _ 2o _ 4 ，限制了晶界的迁移，从而抑制了氧化铝晶粒的异常长大。
