Materials for printed boards and other interconnecting structures - part 2 - 12 : sectional specification set for reinforced base materials , clad and unclad - epoxide non - woven aramid laminate of defined flammability , copper - clad 印制板材料和其它互联结构.第2 - 12部分:包被或非包被增强基底材料分规范装置,限定可燃性的铜包被的非编织的芳香聚酰胺层状环氧化物
Based on the results from x - ray photoelectron spectroscopy ( xps ) , the changes of films deposited under power and time are investigated , and calculate the ratio of f / c , the films contain higher concentration of cross - links 利用光电子能谱( xps ) ，研究了功率和时间与cf膜结构及各组分比例的关系及变化规律，计算了f c比，发现cf膜交联结构占很大比例。
The lna with source inductor degeneration is analyzed in detail , which is used most widely in current . base on the analysis , a cascode structure is presented to minimize the effect of gate - drain capacitance cgd 针对目前lna中应用最广泛的源极电感负反馈结构,进行了详细分析,在此基础上对该结构做出了优化,采用共源共栅级联结构,减小了栅漏电容cgd的影响。
Materials for printed boards and other interconnecting structures - part 2 - 13 : sectional specification set for reinforced base materials , clad and unclad - cyanate ester non - woven aramid laminate of defined flammability , copper - clad 印制板材料和其它互联结构.第2 - 13部分:包被或非包被增强基底材料分规范装置,限定可燃性的铜包被的非编织的芳香聚酰胺层状氰酯
E materials for printed boards and other interconnecting structures - part 2 - 5 : reinforced base materials , clad and unclad - brominated epoxide cellulose paper reinforced core woven e - glass reinforced surfaces laminated sheets of defined flammability vertical burning test , copper - clad 印制板和其他互联结构用材料.第2 - 5部分:包被和非包被增强基材.阻燃型
E materials for printed boards and other interconnecting structures - part 2 - 5 : reinforced base materials , clad and unclad - brominated epoxide cellulose paper reinforced core woven e - glass reinforced surfaces laminated sheets of defined flammability vertical burning test , copper - clad 印制板和其他互联结构用材料.第2 - 5部分:包被和非包被增强基材.阻燃型
Materials for interconnection structures - sectional specification set for reinforced base materials , clad and unclad - cyanate ester non - woven aramid laminate of defined flammability , copper - clad - cyanate ester non - woven aramid laminate of defined flammability copper - clad 互联结构材料.增强基材包被和未包被增强基材分规范集.阻燃型铜包被的非编织的芳香聚酰胺氰酸酯层压板材
The amplified spontaneous emission ( ase ) is studied . both the forward and backward ase is simulated and their characters are analyzed in detail . then the dual stage cascade structure is presented as a solution to reduce the ase noise 2 .研究了edfa中放大的自发辐射噪声光( ase ) ,详细分析了前后向ase噪声光的性质,在此基础上,提出了双段级联结构抑制ase噪声光,并对这种方法进行了理论和实验研究。
Based on the actuating mechanism of sma , two new concepts which are called process - uncontrollability and quasi process - controllability , and a design idea which is called element - interconnection used to achieve quasi process - controllability of sma microactuators , are presented 针对sma的驱动机理，本文概括了sma的驱动过程不易控特性，并提出单元互联结构这一实现sma微执行器驱动过程准可控的设计概念。
Brown yellow or red brown molding powder , has weak special smell , can dissolve in water and ethanol , not dissolve in ethyl ether and chloroform , good stability , no stimulate , has strong extermination effect to bacteria , virus , epiphyte , mildew and sporule . application 由于pvpp的高分子量和交联结构，不溶于水但遇水能迅速将水引入，促使其网络结构膨胀产生崩解作用，所以pvpp是医药上广泛应用于片剂颗粒剂及胶囊剂的崩解剂填充剂。
