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组装技术

"组装技术"的翻译和解释

例句与用法

  • The fine powders of the solder alloy are one of the key materials in the smt , the requirement as following : the particle diameter is in 5 u m ~ 74 u m , the shape is spherical and the distribution of the particle size is uniform
    表面组装技术( smt )已广泛应用于电子工业中,而焊锡合金微粉是该技术的关键材料之一,通常要求:粉末粒径5 74 m ,形状为球形,且粒径分布均匀。
  • The ionic self - assembly deposition technique is a newly developed technique used to fabricate thin films of photoelectric parts with its main advantages : easy o peration , controllable film thickness and compound in molecular size
    离子自组装技术是新发展起来的一种薄膜器件制备技术,其优点是:操作简单,膜厚可控,分子尺度复合,成膜容易,用此技术制备光伏器件研究刚刚开始。
  • The self - assembly strategy will play an important role in the development of nanotechnology and nanostructured materials , and the electrostatic self - assembly monolayer technique is a novel approach to the build - up of nanocomposite functional thin films and thin - film - based devices
    组装技术在纳米科技、纳米材料的发展与研究中具有重要作用,特别是静电吸附自组装技术对纳米复合功能薄膜及其器件的研究具有重要意义。
  • Ate china is the only assembly exhibition event , providing an unparalleled platform in the vibrant south china market for the entire assembling industry to generate business contacts and enhance brand awareness for keeping your company ahead of competition
    华南国际工业组装技术与装备展览会是中国华南地区唯一的专注于工业组装技术与装备应用领域的专业展览会,为企业创造一个在华南市场拓展业务、凝聚品牌价值、保持强大竞争力的平台。
  • On the basis of virtual evolving technology of surface mount technology ( smt ) for the solder joints , design for manufacturing ( dfm ) is employed , and dfm - oriented smt virtual assembly system targeted at assembly quality and solder joint reliability is developed
    摘要在表面组装技术焊点虚拟成形技术的基础上,运用面向制造的设计思想,以表面组装技术组装质量与焊点可靠性为目标,研究面向表面组装技术生产组装工艺设计的产品虚拟组装系统。
  • Taiyou kinzoku manufactures and sells bolt - free storage racks , which employ an assembly technology that eliminates the need for welding and screws . this assembly technology makes use of timberwork techniques that have been handed down from ancient times , and which do not use nails or adhesives
    在现代化的今天,充分利用从古代传承下来的不使用木框钉胶的组装技术,以及不利用焊接进行固定,不使用任何螺丝的组装技术,开发制造和销售无螺丝保管货架。
  • Universal instruments is a global electronics productivity specialist , providing innovative circuit , semiconductor , and back - end assembly technologies and equipment , integrated system solutions , and process expertise to manufacturers in every sector of the global electronics industry
    环球仪器公司是一家全球性的电子产品生产设备专业制造商,为全球电子行业各领域的制造厂商提供富有创新性的电路、半导体、后端组装技术和设备、集成系统解决方案及专项工艺技术。
  • Based on the mesne layer theory , the centralized stress cantilever was designed , and the infection factors was analysed in detail . in the designing of controditional circuits , comparing with several troditional methods and the merits was integrated , a novel circuits with fewer components and higher performance was designed , and by using the micro assembly techniques , the circuits was minisized
    文中以材料力学的中性层理论为理论依据,设计了结构独特的应力集中结构悬臂梁,并对各影响因素进行了详细分析。在调理电路的设计中,通过对几种传统方案的比较,综合了它们的优点,设计了一种元件少、性能佳的新型电路,并采用微组装技术,实现调理电路微型化。
  • The equipment incorporates assembling and sintering and the temperature curves can be set according to users " need . the accuracy of temperature control can be controlled within 1 ? . in assembling , the tubes align automatically , thus reducing deviations of assemblers operation
    中国科学院博士学位论文:无铝半导体激光器列阵及其组装技术的研究该设备集组装和烧结于一体,可根据需要任意设定温度曲线,温度精度控制在1 “ c之内;组装时管芯自动对齐,减少了由组装者操作产生的偏差。
  • Hic has been the important technical channel for realizing the small - scale , multi - functional , high - performance , highly reliable military electric equipment , for hic make good use of high - integration , high - speed and other characters of sic , and formed a new - generation advanced microelectronic assembly technique
    混合集成电路( hic )充分利用半导体集成电路( sic )高集成度、高速等特点,形成新一代高级的微电子组装技术,并已成为实现军用电子装备小型化、多功能化、高性能化、高可靠性的重要技术途径。
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