焊点

• The current crowding effect and temperature distributions in flip chip solders are discussed
  本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
• Test methods for lead - free solders - part 6 : methods for 45 pull test of solder joints on qfp lead
  无铅焊剂的试验方法.第6部分: qfp铅焊点45拉伸试验方法
• The results show that the mixed solder joints are feasible when the process parameters are controlled properly
  结果显示，只要工艺参数控制得当，混合焊点是可行的。
• Recently it becomes a hot point to find the defects of the solder joint in time and effectively
  近年来,如何及时有效的发现焊点的缺陷一直是电子组装行业研究的一个热点。
• Its development is based upon the solution of the reliability of solder ball , which is one of the key problems
  而焊点可靠性问题是发展bga csp技术需解决的关键问题之一。
• Inspection methods on solder joints quality include two types : destructive testing and non - destructive testing
  焊点质量的检测方式,宏观上可分为两类:有损检测和无损检测。
• As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps
  当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
• But the wild child boldly gets rid of him with a fluid shield and has yielded a building without welds
  但这狂野的小孩勇敢地以一种流体质除去了他，成功地生产了一座无焊点的建筑。
• Welding - acceptance inspection of electron beam welding machines - part 6 : measurement of stabilitry of spot position
  焊接.电子束焊接机的验收检验.第6部分:焊点位置稳定性的测量
• Feature : wide suitability , firm welding spot , easy operation , stable function , safety & stability and so on
  特点：该机具有适应范围广、焊点牢固、操作方便、性能稳定、安全可靠等优点。