Introduction of the chip package technology 芯片封装技术介绍
The development of wafer - level packaging 圆片级封装技术展望
Development and application of modern wafer - level packaging technology 现代圆片级封装技术的发展与应用
The advanced chip package technology 先进芯片封装技术
Wafer - level packaging technology 圆片级封装技术
Fast tdd switching technologies 表面封装技术
A design method of interfacing which based on state machine structure is proposed 提出了基于状态机的接口封装技术。
To provide consultation and training to engineers / technicians on materials science / technology , and semiconductor packaging technology 为工程师和技术员提供原材料技术和半导体封装技术支持和培训。
Analyzing the principal theory of fgs . summarizing and comparing all kinds of packaging , demodulation and multiplexing techniques of fiber gratings . 2 分析了光纤光栅传感的基本原理,并归纳比较了光纤光栅的各种封装技术、解调技术和复用技术。
With the development of vlsi , there are increasing demands for 1c interconnection . the high - density package technology becomes mainstream in advanced systems 大规模集成电路的发展，对芯片之间的互连提出了更高的要求，高端电子系统中高密度封装技术逐渐成为发展的主流。
