A kind of polishing wheel installed in the equipments imported from germany or czechoslovakia and in the polishing machine for crystal glass decoration , which is made from high flexible macromolecule , aluminum oxide and cerium oxide 一种安装在德国、捷克进口设备以及国内自主研发的水晶玻璃饰品研磨机上的抛光盘（轮） ，它是由高弹性和高强度的高分子材料与很锋利的抛光性能极佳的氧化铝、氧化铈等软质磨料进行混合反应而制作。
A kind of polishing wheel installed in the equipments imported from germany or czechoslovakia and in the polishing machine for crystal glass decoration , which is made from high flexible macromolecule , aluminum oxide and cerium oxide 信息描述：一种安装在德国、捷克进口设备以及国内自主研发的水晶玻璃饰品研磨机上的抛光盘（轮） ，它是由高弹性和高强度的高分子材料与很锋利的抛光性能极佳的氧化铝、氧化铈等软质磨料进行混合反应而制作。
A kind of polishing wheel installed in the equipments imported from germany or czechoslovakia and in the polishing machine for crystal glass decoration , which is made from high flexible macromolecule , aluminum oxide and cerium oxide 产品描述：一种安装在德国、捷克进口设备以及国内自主研发的水晶玻璃饰品研磨机上的抛光盘（轮） ，它是由高弹性和高强度的高分子材料与很锋利的抛光性能极佳的氧化铝、氧化铈等软质磨料进行混合反应而制作。
In order to evaluate the capability of ctp in theory and understand the mechanisms of ctp , the hydrodynamic model of ctp without considering deformation of pad was set up and solved by numerical method . the model involves two contact conditions : the full - film contact and partial - film contact 为了从理论上评价ctp的性能并掌握其机理,以便应用于指导实际,本文基于全膜接触和部分膜接触两种工况,建立了不考虑抛光盘变形的ctp流体动力学模型并进行了数值求解。
The crystal glass decoration that my company produces uses and throws a biggest characteristics of polishing wheel and is polishing process in , is not appear to fry line phenomenon by the processed decoration , drive process of surface beauty , the shining degree is high , and the efficiency of polishing wheel is high , service life long , and is the optimal tool for polishing crystal glass and diamond 我公司生产的水晶玻璃饰品用抛光盘（轮）最大的特点是在抛光过程中，被加工的饰品不会出现炸纹现象，被加工的表面美观，光亮度高，并且抛光盘（轮）抛光效率高，使用寿命长，是水晶钻石（水钻）的理想抛光工具。
The cmp experiment was carried out systematically on litao3 wafer . the polished surface foughness and material removal rate in different polishing conditions were measured and the effects of polishing pad material and its condition , pressure , rotating speed of the polishing plate , the type and size of abrasive , and the properties of the polishing slurry on the surface routhness and material removal rate were analysed in details 通过对钽酸锂晶片的化学机械抛光过程的实验研究，通过测量钽酸锂晶片在不同抛光条件下的表面粗糙度和材料去除率，详细分析了抛光垫材料和状态、抛光压力、抛光盘转速、磨料种类及粒度、抛光液组成等几个因素对抛光表面质量和材料去除率的影响规律。
