Releasing steam " heat from the mass concrete structures while solidifying leads to produce the temperature change and contraction 大体积混凝土在固化过程释放的水化热会产生较大的温度变化和收缩作用。
Popping a paint defect resembling fine blistering . popping is usually caused by organic solvents trapped during the film cure 水泡涂料缺陷，类似小水泡。水泡通常在涂膜固化过程中由于有机溶剂集结面形成的。
D . a . klosterman and t . e . saliba , development of an on - line in - sytufiber - optic void sensor , journal of thermoplastic composite materials , 1994 , 7 （ 21 ） 9 229 杨春. “用于环氧树脂固化过程实时监测的光纤倏逝波传感器” ，复合材料学报，已录用
Steele . j p h , liu . y m , ganesh . c , jones j e . fiber optic sensor development for real - time in situ epoxy cure . journal of composite materials , 1997 , 31 ( 1 ) : 87 102 杨春. “用于环氧树脂固化过程实时监测的光纤倏逝波传感器” ，复合材料学报，已录用
A fortran code was developed based on the models , and it can be used to simulate both infiltration of resin into a textile perform and cure of the resin saturated perform 本文用fortran语言编写了rfi工艺过程的模拟程序，该程序可以用来模拟树脂对纤维预制件的浸渍过程和浸渍充模完成后整个构件的固化过程。
When the substrate is alios ceramic substrate , the shear stress hovers over a relatively high negative level during curing process and steps to a relatively low level during cooling down 对于陶瓷基板，在固化过程中，剪切应力并不象fr4基板上所表现的那样，在零点上下波动，而是处于一个绝对值较大的负值。
Thermal analysis of the adhesive was performed to identify the incomplete cure of the adhesive after first curing process and the penetration of moisture into the package is the main reason for sharp stress increase 运用tga 、 dta等热分析手段对粘合剂的固化过程和再固化过程进行了研究，并对实验中的应力突变的机理进行探讨，认为水汽是导致应力突变的主要原因。
The intercalation and exfoliation behavior of lamellar clay in the thermoset resin / clay composites during curing was studied in this paper . for epoxy / organoclay system , intercalation and exfoliation behavior of organoclays in epoxy resin has been investigated 本论文以热固性树脂/粘土复合体系为研究对象，主要研究了分散在聚合物基质中的层状粘土在固化过程中插层和剥离行为。
When the substrate is fr4 , the surface shear stress and normal stress difference is at a low level and near zero during curing process and build up during cooling down because of the mismatch of ctes of silicon and substrate 对于fr4基板，在固化过程中，芯片表面的剪切应力和正应力的值很小，其数值在原点上下很窄的范围内波动。在降温过程中，热膨胀系数的失配随着温度的降低而越来越显著，引起应力的积聚。
The paper presents a solution method for the transient temperature field , in which the finite element method or the finite difference method is used to get discrete structure , and the finite difference method is used to get discrete time in order to simplify the transient thermal conductive equations as a set of linear equations as a set of linear equations at different moment 本文提出对空间采用有限元法或有限差分法，而对时间采用有限差分法将瞬态热传导方程简化为不同时刻的线性方程组以求解瞬态温度场，用以求解大体积混凝土在固化过程中不同时刻的温度分布。
